AMAOE U-SMG3 Stencil: Samsung Exynos High-End & Mid-Range Expert

Product Overview

The AMAOE U-SMG3 Stencil (U-SMG3_钢网) is a high-precision, stainless steel reballing stencil from the “UBGA-Tin Planting Expert Series” (UBGA-植锡专家系列). It is crucial for technicians performing microsoldering repairs on a range of Samsung devices, specifically targeting the Exynos 9810/9820 flagship series and the later Exynos 850/3830 mid-range series.

Model: AMAOE U-SMG3
Thickness: 0.12MM (Standard professional thinness for precise solder application).
Material: High-quality, durable stainless steel that resists heat and warping.
Patent: ZL2016213989365 (Indicating a patented product design).

Key Supported Processors (CPUs/SoCs)

The stencil is designed to reball the following significant Samsung Exynos Application Processors (AP) used in devices like the Galaxy S9, S10, and modern A-series phones:

Chip Model	Commercial Exynos Series	Function / Notes
Exynos9820	Exynos 9820 Series	Flagship SoC (e.g., Samsung Galaxy S10 series)
Exynos9810	Exynos 9810 Series	Flagship SoC (e.g., Samsung Galaxy S9 / Note 9 series)
Exynos850	Exynos 850 Series	Mid-Range SoC (e.g., Samsung Galaxy A-series)
Exynos3830	Exynos 3830 (Internal)	Mid-Range SoC (Often associated with the 850/9610 family)

Supported Auxiliary Components

While the image does not list every single companion IC (Power Management, RF, etc.) by individual number, it explicitly includes a critical memory footprint:

Component/Footprint	Type	Function / Notes
RAM556	RAM Footprint	Designed for reballing the specific RAM module size/pinout (often a multi-layer chip) associated with these Exynos CPUs.

Summary of Use

The AMAOE U-SMG3 provides the essential patterns for repairing logic board failures related to the CPU and stacked RAM on flagship Samsung models (S9/Note 9/S10) and mass-market mid-range devices (A-series) that utilize the specified Exynos chips.

Main CPU / SoC Models (The Processors)

These are the primary Samsung Exynos Application Processors (AP/SoCs) that the stencil is designed to reball:

Chip Model	Commercial Exynos Series	Function / Notes
Exynos9820	Exynos 9820 Series	Flagship SoC (e.g., used in Galaxy S10 series)
Exynos9810	Exynos 9810 Series	Flagship SoC (e.g., used in Galaxy S9 / Note 9 series)
Exynos850	Exynos 850 Series	Mid-Range SoC (e.g., used in various Galaxy A-series)
Exynos3830	Exynos 3830 (Internal designation)	Mid-Range SoC (Often associated with the 850/9610 family)

II. Supporting Components

This is a critical memory footprint included on the stencil, often necessary when reballing the CPU itself:

Component/Footprint	Type	Function / Notes
RAM556	RAM Footprint	Designed for reballing the specific RAM (Random Access Memory) module size/pinout (often a multi-layer chip) associated with these Exynos CPUs.

Since the list you provided in the previous response detailed the Exynos9820, Exynos9810, Exynos850, and Exynos3830 chips (which are supported by the AMAOE U-SMG3 stencil), here are the most notable mobile phone models that use those specific processors:

This list covers the major Samsung Galaxy flagship and popular A-series phones that a technician using the U-SMG3 stencil would encounter for CPU/RAM reballing:

Exynos Chip Model	Mobile Phone Models (Examples)	Series Category
Exynos 9820	Samsung Galaxy S10, S10+, S10e, S10 5G	Flagship (2019)
Exynos 9810	Samsung Galaxy S9, S9+, Note 9	Flagship (2018)
Exynos 850	Samsung Galaxy A21s, A13, A12 Nacho, M13	Mid-Range / Budget
Exynos 3830	Often used as an internal component or refers to a chip closely related to the Exynos 850 or 9610.	Mid-Range