AMAOE U-SMG3 Stencil: Samsung Exynos High-End & Mid-Range Expert
AMAOE U-SMG3 Stencil: Samsung Exynos High-End & Mid-Range Expert

AMAOE U-SMG3 Stencil: Samsung Exynos High-End & Mid-Range Expert

AMAOE SMG:3– SUPPORTED ICS, CP

Exynos850

Exynos3830

Exynos9820

Exynos9810

RAM556

₹300.00

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AMAOE U-SMG3 Stencil: Samsung Exynos High-End & Mid-Range Expert
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AMAOE U-SMG3 Stencil: Samsung Exynos High-End & Mid-Range Expert

 

AMAOE U-SMG3 Stencil: Samsung Exynos High-End & Mid-Range Expert

 

AMAOE U-SMG3 Stencil: Samsung Exynos High-End & Mid-Range Expert

 

 

Product Overview

 

The AMAOE U-SMG3 Stencil (U-SMG3_钢网) is a high-precision, stainless steel reballing stencil from the “UBGA-Tin Planting Expert Series” (UBGA-植锡专家系列). It is crucial for technicians performing microsoldering repairs on a range of Samsung devices, specifically targeting the Exynos 9810/9820 flagship series and the later Exynos 850/3830 mid-range series.

  • Model: AMAOE U-SMG3
  • Thickness: 0.12MM (Standard professional thinness for precise solder application).
  • Material: High-quality, durable stainless steel that resists heat and warping.
  • Patent: ZL2016213989365 (Indicating a patented product design).

 

Key Supported Processors (CPUs/SoCs)

 

The stencil is designed to reball the following significant Samsung Exynos Application Processors (AP) used in devices like the Galaxy S9, S10, and modern A-series phones:

Chip Model Commercial Exynos Series Function / Notes
Exynos9820 Exynos 9820 Series Flagship SoC (e.g., Samsung Galaxy S10 series)
Exynos9810 Exynos 9810 Series Flagship SoC (e.g., Samsung Galaxy S9 / Note 9 series)
Exynos850 Exynos 850 Series Mid-Range SoC (e.g., Samsung Galaxy A-series)
Exynos3830 Exynos 3830 (Internal) Mid-Range SoC (Often associated with the 850/9610 family)

 

Supported Auxiliary Components

 

While the image does not list every single companion IC (Power Management, RF, etc.) by individual number, it explicitly includes a critical memory footprint:

Component/Footprint Type Function / Notes
RAM556 RAM Footprint Designed for reballing the specific RAM module size/pinout (often a multi-layer chip) associated with these Exynos CPUs.

 

Summary of Use

 

The AMAOE U-SMG3 provides the essential patterns for repairing logic board failures related to the CPU and stacked RAM on flagship Samsung models (S9/Note 9/S10) and mass-market mid-range devices (A-series) that utilize the specified Exynos chips.

 

Main CPU / SoC Models (The Processors)

 

These are the primary Samsung Exynos Application Processors (AP/SoCs) that the stencil is designed to reball:

Chip Model Commercial Exynos Series Function / Notes
Exynos9820 Exynos 9820 Series Flagship SoC (e.g., used in Galaxy S10 series)
Exynos9810 Exynos 9810 Series Flagship SoC (e.g., used in Galaxy S9 / Note 9 series)
Exynos850 Exynos 850 Series Mid-Range SoC (e.g., used in various Galaxy A-series)
Exynos3830 Exynos 3830 (Internal designation) Mid-Range SoC (Often associated with the 850/9610 family)

 

II. Supporting Components

 

This is a critical memory footprint included on the stencil, often necessary when reballing the CPU itself:

Component/Footprint Type Function / Notes
RAM556 RAM Footprint Designed for reballing the specific RAM (Random Access Memory) module size/pinout (often a multi-layer chip) associated with these Exynos CPUs.

Since the list you provided in the previous response detailed the Exynos9820, Exynos9810, Exynos850, and Exynos3830 chips (which are supported by the AMAOE U-SMG3 stencil), here are the most notable mobile phone models that use those specific processors:

This list covers the major Samsung Galaxy flagship and popular A-series phones that a technician using the U-SMG3 stencil would encounter for CPU/RAM reballing:

Exynos Chip Model Mobile Phone Models (Examples) Series Category
Exynos 9820 Samsung Galaxy S10, S10+, S10e, S10 5G Flagship (2019)
Exynos 9810 Samsung Galaxy S9, S9+, Note 9 Flagship (2018)
Exynos 850 Samsung Galaxy A21s, A13, A12 Nacho, M13 Mid-Range / Budget
Exynos 3830 Often used as an internal component or refers to a chip closely related to the Exynos 850 or 9610. Mid-Range

Technical Specifications:

 

  • Material: Stainless Steel
  • Pattern: Square
  • Dimensions (W x H): 10 x 8 cm
  • Thickness: 0.12mm
  • Color: Silver
  • Item Weight: 50 g
  • Country of Origin: China
  • Net Quantity: 1
  • Reusable: Yes

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of  RS 80  will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

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We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com    Or     Call 989533347

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COD SHIPPING CHARGE RS150/- ALL INDIA

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AMAOE U-SMG3 Stencil: Samsung Exynos High-End & Mid-Range Expert
AMAOE U-SMG3 Stencil: Samsung Exynos High-End & Mid-Range Expert

₹300.00

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Need help? Call our award-winning support team 24/7 at +919895333473

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  • Binu Mobiles 
  • No. 6/429-c (12)
     Land Ship Mall,
     Mavoor Road Junction,
     Kozhikode, Pin - 673001 
  • (+91) 9895333473
Mobileicbinu@gmail.com

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Product Subtotal
Qualcomm CPU+Baseband QSC1110 MSM7227 MSM6246 MDM6600 MSM6260 MDM9600 QSC6270 MDM9215M MDM8215 QSC1105 MSM7521 MSM8909W stencil Mega-Idea  × 1 ₹350.00
AMAOE U-SMG3 Stencil: Samsung Exynos High-End & Mid-Range Expert  × 1 ₹300.00
Subtotal ₹650.00
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Total ₹730.00

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Subtotal:
₹650.00
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