AMAOE U-SMG2 Stencil: Samsung Exynos 9610 7885 7904 9611 CPU STENCIL

Name: AMAOE U-SMG2 Stencil: Samsung Exynos 9610 7885 7904 9611 CPU STENCIL - mobilestencil
Price: 300.00 INR
Availability: InStock

AMAOE U-SMG2 Stencil: Samsung Exynos Mid-Range Repair Expert

Product Overview

The AMAOE U-SMG2 Stencil (U-SMG2_钢网) is a precision reballing stencil from the “UBGA-Tin Planting Expert Series” (UBGA-植锡专家系列). It is specifically designed to support the reballing of several generations of widely used Samsung Exynos mid-range SoCs and their custom, co-dependent Power Management and RF ICs.

Model: AMAOE U-SMG2
Thickness: 0.12MM (Standard professional thinness for highly accurate solder work).
Target Series: Exynos 7870, 7880, 7884, 7885, 7904, 9610, 9611 (These chips were the backbone of many budget and mid-tier Samsung devices from 2017–2020).
Material: High-quality stainless steel, ensuring durability and heat resistance.
Patent: ZL2016213989365 (Indicates a patented product design).

Key Supported Processors (CPUs/SoCs)

The stencil covers a large family of Samsung’s mid-range processors, including specific footprints for both the CPU and its dedicated RAM layer:

Exynos Chip Model	Associated RAM Footprint	Function / Notes
Exynos9610 / Exynos9611	Exynos9610/9611 RAM	High-Performance Mid-Range SoCs (e.g., Galaxy A50, M30s)
Exynos7884 / Exynos7885 / Exynos7904	Exynos7884/7885/7904 RAM	Upper Mid-Range SoCs (e.g., Galaxy A8, M20, A30)
Exynos7870 / Exynos7880	Exynos7870/7880 RAM	Workhorse Mid-Range SoCs (e.g., Galaxy J7, A5, A7)

Supported Companion ICs and Footprints

The stencil is highly comprehensive, including patterns for many custom Samsung Power Management and Connectivity components that must be reballed during logic board repair:

Power Management ICs (PMICs)

Chip Model	Function / Notes
S2MU004X, S2MU005X03	PMICs (Primary Samsung Power Management ICs)
S925D2, S915	PMICs (Auxiliary Power or Sub-PMICs)
SM5713	Charging/Power IC (Often a Samsung or partner charging controller)
S515, S527S	PMICs/Auxiliary (Additional power or logic control chips)

RF and Connectivity Chips

Chip Model	Function / Notes
SHANNON937	Shannon Modem/RF (Older Samsung modem/RF module)
77656-11	RF Front-End Module (FEM) (Power Amplifier/Switch)
BCM43456HKUBG	Broadcom Connectivity Chip (Handles Wi-Fi/Bluetooth/GPS)
D5328/TFBMA, MU106X01-5	Auxiliary/Other (Various supporting ICs)

Universal Memory Footprints

Footprint	Function / Notes
BGA153	Universal Memory Footprint (For UFS/eMMC memory chips).

Summary of Use

The AMAOE U-SMG2 is arguably one of the most useful stencils for high-volume service centers, as it covers the most commonly repaired, high-selling Samsung mid-range models. It allows technicians to efficiently repair power issues, boot loops, and connectivity failures by correctly reballing the CPU, RAM, and supporting power chips.

Exynos Chip Model	Mobile Phone Models (Examples)	Series Category
Exynos 9610 / Exynos 9611	Samsung Galaxy A50, A50s, A51	Upper Mid-Range
	Samsung Galaxy M30s, M31, M21	Mid-Range / Online Exclusive
Exynos 7885 / Exynos 7904	Samsung Galaxy A8 (2018), A7 (2018), A30, M20	Mid-Range
Exynos 7880	Samsung Galaxy A5 (2017), A7 (2017)	Mid-Range
Exynos 7870	Samsung Galaxy J7 (2016), J5 (2017), Tab A (2017)	Budget / Mid-Range
Exynos 7884	Samsung Galaxy A10 (and variants)	Budget / Entry-Level

Summary of Stencil Utility

The AMAOE U-SMG2 is a crucial stencil for repairing the logic boards of these high-volume Samsung devices. When the technician uses the stencil to reball the specified:

CPUs/RAM: Exynos9610/9611, Exynos7884/7885/7904, Exynos7870/7880, and their RAM footprints.
PMICs: S2MU004X, S2MU005X03, SM5713.
Modem/RF: SHANNON937, BCM43456HKUBG.