AMAOE U-SMG2 Stencil: Samsung Exynos 9610 7885 7904 9611 CPU STENCIL

U-SMG2 STENCIL Qualcomm CP

D5328/TFBMA
77656-11
SHANNON937
S2MU004X
S925D2 
S2MU005X03
BGA153

Exynos7870/7880 RAM
Exynos9610/9611 RAM
Exynos9610/9611
Exynos7884/7885/7904
Exynos7884/7885/7904 RAM
BCM43456HKUBG
S915
MU106X01-5
S515
S527S
SM5713
Exynos7870/7880
Exynos9610/9611/7904/7885/7884/7880/7870

300.00

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AMAOE U-SMG2 Stencil: Samsung Exynos 9610 7885 7904 9611 CPU STENCIL

 

AMAOE U-SMG2 Stencil: Samsung Exynos 9610 7885 7904 9611 CPU STENCIL

 

 

AMAOE U-SMG2 Stencil: Samsung Exynos Mid-Range Repair Expert

 

 

Product Overview

 

The AMAOE U-SMG2 Stencil (U-SMG2_钢网) is a precision reballing stencil from the “UBGA-Tin Planting Expert Series” (UBGA-植锡专家系列). It is specifically designed to support the reballing of several generations of widely used Samsung Exynos mid-range SoCs and their custom, co-dependent Power Management and RF ICs.

  • Model: AMAOE U-SMG2
  • Thickness: 0.12MM (Standard professional thinness for highly accurate solder work).
  • Target Series: Exynos 7870, 7880, 7884, 7885, 7904, 9610, 9611 (These chips were the backbone of many budget and mid-tier Samsung devices from 2017–2020).
  • Material: High-quality stainless steel, ensuring durability and heat resistance.
  • Patent: ZL2016213989365 (Indicates a patented product design).

 

Key Supported Processors (CPUs/SoCs)

 

The stencil covers a large family of Samsung’s mid-range processors, including specific footprints for both the CPU and its dedicated RAM layer:

Exynos Chip Model Associated RAM Footprint Function / Notes
Exynos9610 / Exynos9611 Exynos9610/9611 RAM High-Performance Mid-Range SoCs (e.g., Galaxy A50, M30s)
Exynos7884 / Exynos7885 / Exynos7904 Exynos7884/7885/7904 RAM Upper Mid-Range SoCs (e.g., Galaxy A8, M20, A30)
Exynos7870 / Exynos7880 Exynos7870/7880 RAM Workhorse Mid-Range SoCs (e.g., Galaxy J7, A5, A7)

 

Supported Companion ICs and Footprints

 

The stencil is highly comprehensive, including patterns for many custom Samsung Power Management and Connectivity components that must be reballed during logic board repair:

 

Power Management ICs (PMICs)

 

Chip Model Function / Notes
S2MU004X, S2MU005X03 PMICs (Primary Samsung Power Management ICs)
S925D2, S915 PMICs (Auxiliary Power or Sub-PMICs)
SM5713 Charging/Power IC (Often a Samsung or partner charging controller)
S515, S527S PMICs/Auxiliary (Additional power or logic control chips)

 

RF and Connectivity Chips

 

Chip Model Function / Notes
SHANNON937 Shannon Modem/RF (Older Samsung modem/RF module)
77656-11 RF Front-End Module (FEM) (Power Amplifier/Switch)
BCM43456HKUBG Broadcom Connectivity Chip (Handles Wi-Fi/Bluetooth/GPS)
D5328/TFBMA, MU106X01-5 Auxiliary/Other (Various supporting ICs)

 

Universal Memory Footprints

 

Footprint Function / Notes
BGA153 Universal Memory Footprint (For UFS/eMMC memory chips).

 

Summary of Use

 

The AMAOE U-SMG2 is arguably one of the most useful stencils for high-volume service centers, as it covers the most commonly repaired, high-selling Samsung mid-range models. It allows technicians to efficiently repair power issues, boot loops, and connectivity failures by correctly reballing the CPU, RAM, and supporting power chips.

 

 

Exynos Chip Model Mobile Phone Models (Examples) Series Category
Exynos 9610 / Exynos 9611 Samsung Galaxy A50, A50s, A51 Upper Mid-Range
Samsung Galaxy M30s, M31, M21 Mid-Range / Online Exclusive
Exynos 7885 / Exynos 7904 Samsung Galaxy A8 (2018), A7 (2018), A30, M20 Mid-Range
Exynos 7880 Samsung Galaxy A5 (2017), A7 (2017) Mid-Range
Exynos 7870 Samsung Galaxy J7 (2016), J5 (2017), Tab A (2017) Budget / Mid-Range
Exynos 7884 Samsung Galaxy A10 (and variants) Budget / Entry-Level

 

Summary of Stencil Utility

 

The AMAOE U-SMG2 is a crucial stencil for repairing the logic boards of these high-volume Samsung devices. When the technician uses the stencil to reball the specified:

  • CPUs/RAM: Exynos9610/9611, Exynos7884/7885/7904, Exynos7870/7880, and their RAM footprints.
  • PMICs: S2MU004X, S2MU005X03, SM5713.
  • Modem/RF: SHANNON937, BCM43456HKUBG.

They are directly repairing common issues like boot loops, charging faults, and no-power states in the models listed above.

 

Technical Specifications:

 

  • Material: Stainless Steel
  • Pattern: Square
  • Dimensions (W x H): 10 x 8 cm
  • Thickness: 0.12mm
  • Color: Silver
  • Item Weight: 50 g
  • Country of Origin: China
  • Net Quantity: 1
  • Reusable: Yes

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of  RS 80  will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

Shipping Partner Dtdc Courier

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We Currently Ship Products Only Within India. You Can Place Orders From Across The World But Delivery Addresses Are Restricted To India.

We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com    Or     Call 989533347

Cash On Delivery (Cod) Available

 

Advance Payment Rs 100

COD SHIPPING CHARGE RS150/- ALL INDIA

Thousand Rupees Above Order Full Amount Cod Available

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AMAOE U-SMG2 Stencil: Samsung Exynos 9610 7885 7904 9611 CPU STENCIL
AMAOE U-SMG2 Stencil: Samsung Exynos 9610 7885 7904 9611 CPU STENCIL

300.00

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India

Product Subtotal
Qualcomm CPU7 QS13 stencils QiAnLi  × 1 350.00
Exynos stencil samsung CPU 2 QS23  × 1 350.00
AMAOE U-SMG2 Stencil: Samsung Exynos 9610 7885 7904 9611 CPU STENCIL  × 1 300.00
Subtotal 1,000.00
Shipping
Total 1,080.00
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