AMAOE U-QSD2 BGA Reballing Stencil MSM 8998 8996 (Qualcomm Snapdragon 835/820 Collection)

AMAOE U-QSD2 BGA Reballing Stencil (Qualcomm Snapdragon 835/820 Collection)

Product Overview

The AMAOE Stencil-U-QSD2 (U-QSD2) is a dedicated, high-precision BGA (Ball Grid Array) reballing stencilfrom the patented UBGA – Solder Replanting Expert Series. This tool is crucial for professional technicians repairing smartphones and devices featuring the Qualcomm Snapdragon 820 and Snapdragon 835 flagship processors, including the corresponding RAM chips. The stencil is designed to ensure maximum accuracy for these large, complex SoCs.

Key Features and Specifications

• Model: Stencil-U-QSD2 / U-QSD2
• Brand: AMAOE Easy Repair®
• Application: BGA Rework/Reballing for a collection of high-end Qualcomm Snapdragon CPUs and RAM packages. The product is marketed as the “Qualcomm Snapdragon 835/820, MSM8998/8996 Integrated Network.”

   

• Thickness: 0.12MM—Provides the ideal thickness for precise and uniform solder ball formation on dense BGA patterns.

   

• Material: High-quality steel mesh/stencil.
• Patented Design: ZL2016213989365
• Slogan: Tools made with the experience of repair professionals in mind / making soldering easier!

Compatible Qualcomm (Snapdragon) Chips and RAM

This stencil consolidates the reballing patterns for two major flagship chipsets and their memory components, which were dominant in high-end devices from roughly 2016 to 2018:

This tool is indispensable for advanced mobile technicians who need to perform board-level component replacement or reballing on legacy flagship devices.

The listed components (MSM8998, MSM8996, and BGA153 memory types) represent the flagship and high-end Android smartphones from approximately 2016 through 2018.

MSM8998 is the internal designation for the Qualcomm Snapdragon 835. MSM8996 is the internal designation for the Qualcomm Snapdragon 820 / 821. BGA153 refers to the package type for many eMMC and some UFS memory chips used as the internal storage (ROM) in these, and many other, devices.

Qualcomm Snapdragon Flagship Mobile Models

BGA153 (eMMC/UFS Storage)

BGA153 is not a CPU, but a Physical Package Type for many Flash Memory (Storage) chips:

• BGA153 eMMC: This was the package type for many eMMC (Embedded MultiMediaCard) chips (e.g., up to eMMC 5.1). It was extremely common in a vast number of Android phones and tablets, particularly those launched before UFS became standard in the high-end market.
  • Examples of phones using BGA153 eMMC: Many mid-range to high-end devices from Samsung (Galaxy S4/S5/Note 3), LG, HTC, Xiaomi, OnePlus (older models), and virtually all budget brands from roughly 2013-2016.
• BGA153 UFS: Some early UFS (Universal Flash Storage) chips also used a BGA153 pinout, but often with a slightly different package size/thickness compared to eMMC. UFS storage was used in the Snapdragon 835/820 phones listed above.

In summary: The AMAOE U-QSD2 stencil is designed for the high-volume repair of two of the most popular and widespread Qualcomm flagship chipsets of the mid-2010s, as well as the standard internal storage chips (BGA153) used in a majority of older Android devices.

Technical Specifications:

• Material: Stainless Steel
• Pattern: Square
• Dimensions (W x H): 10 x 8 cm
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes