AMAOE U-QSD1 Stencil MSM 8956 8992 8974 8274 8674 8976 CPU STENCIL

AMAOE U-QSD1 StencilĀ 

BGA153

MSM8

RAM

MSM8976 RAM

MSM8956 RAM

MSM8992

MSM8976

MSM8956

MSM8974

MSM8274

MSM8674



300.00

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AMAOE U-QSD1 Stencil MSM 8956 8992 8974 8274 8674 8976 CPU STENCIL

 

AMAOE U-QSD1 Stencil MSM 8956 8992 8974 8274 8674 8976 CPU STENCIL

 

 

 

AMAOE U-QSD1 Stencil Product Details

 

 

Primary Focus (CPUs/SoCs)

 

The stencil is designed to reball the following main Qualcomm Snapdragon System-on-Chips (SoCs), along with their RAM (Package on Package/PoP) connection points:

Model Number (MSM) Commercial Name Snapdragon Series Device Generation
MSM8974 Snapdragon 800 / 801 High-End (800 Series) Flagship devices from 2013-2014
MSM8274 Snapdragon 800(Variant) High-End (800 Series) Variant for specific modem configurations
MSM8674 Snapdragon 800(Variant) High-End (800 Series) Variant for specific modem configurations
MSM8992 Snapdragon 808 Upper Mid-Range (6-core) Premium devices from 2015-2016
MSM8976 Snapdragon 652 Upper Mid-Range (600 Series) High-performance mid-range devices
MSM8956 Snapdragon 650 Upper Mid-Range (600 Series) High-performance mid-range devices

 

RAM and Package-on-Package (PoP) Support

 

The stencil specifically accommodates the connections for the memory chips that sit directly on top of the CPU (PoP structure), which is critical for successful reballing:

  • MSM8976 RAM
  • MSM8956 RAM
  • MSM8 (General reference for an 8-series RAM structure)

 

Key Specifications

 

Feature Detail
Model AMAOE U-QSD1 (Universal-Qualcomm-SnapDragon 1)
Function BGA Reballing Stencil (ę¤é””, Tin Planting)
Thickness 0.12MM (Standard thinness for precision micro-soldering)
Target Series Snapdragon 800, 801, 808, 650, 652
BGA Support BGA153 (A common footprint for eMMC/UFS flash memory chips)
Sticker Description “é«˜é€šéŖé¾™800/801/808/650/652, MSM8274/8674/8974/8992/8856/8976 ē»¼åˆē½‘-0.12MM”
Patent äø“åˆ©äŗ§å“ ZL2016213989365

 

Summary

 

The U-QSD1 is an essential tool for technicians repairing older, premium devices, as it covers the foundational processors of the mid-2010s smartphone era, most notably the highly popular and repair-prone Snapdragon 801 (MSM8974) and the powerful Snapdragon 650/652 series. The inclusion of RAM reballing spots and the BGA153footprint makes it a true comprehensive solution for these chips.

 

Since the list is the supported chip list, here is the breakdown, showing the specific CPU model and its commercial Snapdragon designation:

Model Number Type of Chip/Footprint Commercial Snapdragon Series Key Devices/Notes
MSM8974 Main SoC (CPU) Snapdragon 800 / 801 Flagship processor of 2013-2014 era.
MSM8274 Main SoC (CPU) Snapdragon 800 Variant of 8974 (typically without integrated LTE).
MSM8674 Main SoC (CPU) Snapdragon 800 Variant of 8974 (supports global CDMA/UMTS).
MSM8992 Main SoC (CPU) Snapdragon 808 High-end processor (6-core) used in devices like the LG G4.
MSM8976 Main SoC (CPU) Snapdragon 652 High-performance upper-mid-range processor.
MSM8956 Main SoC (CPU) Snapdragon 650 High-performance upper-mid-range processor.
MSM8976 RAM RAM Footprint Snapdragon 652 The stencil area for the RAM chip that sits on top of the MSM8976 SoC (PoP).
MSM8956 RAM RAM Footprint Snapdragon 650 The stencil area for the RAM chip that sits on top of the MSM8956 SoC (PoP).
MSM8 RAM Footprint Snapdragon 8xx Series General/grouped memory footprint for the older 8-series.
RAM General Footprint N/A General template for RAM packages.
BGA153 Memory Footprint N/A Standard footprint for eMMC flash storage chips.

Technical Specifications:

 

  • Material: Stainless Steel
  • Pattern: Square
  • Dimensions (W x H): 10 x 8 cm
  • Thickness: 0.12mm
  • Color: Silver
  • Item Weight: 50 g
  • Country of Origin: China
  • Net Quantity: 1
  • Reusable: Yes

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of Ā RS 80 Ā will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

Shipping Partner Dtdc Courier

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We Currently Ship Products Only Within India. You Can Place Orders From Across The World But Delivery Addresses Are Restricted To India.

We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com Ā  Ā Or Ā  Ā  Call 989533347

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AMAOE U-QSD1 Stencil MSM 8956 8992 8974 8274 8674 8976 CPU STENCIL
AMAOE U-QSD1 Stencil MSM 8956 8992 8974 8274 8674 8976 CPU STENCIL

300.00

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Product Subtotal
CPU stencil Qualcomm CPU MSM8917 SDM670 SM8150A SDM845A SM8150B SDM845B SDM710 SM6150 MEGA-IDEA  × 1 350.00
Subtotal 350.00
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Total 430.00
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