AMAOE U-QSD1 Stencil MSM 8956 8992 8974 8274 8674 8976 CPU STENCIL

Name: AMAOE U-QSD1 Stencil MSM 8956 8992 8974 8274 8674 8976 CPU STENCIL - mobilestencil
Price: 300.00 INR
Availability: InStock

AMAOE U-QSD1 Stencil Product Details

Primary Focus (CPUs/SoCs)

The stencil is designed to reball the following main Qualcomm Snapdragon System-on-Chips (SoCs), along with their RAM (Package on Package/PoP) connection points:

Model Number (MSM)	Commercial Name	Snapdragon Series	Device Generation
MSM8974	Snapdragon 800 / 801	High-End (800 Series)	Flagship devices from 2013-2014
MSM8274	Snapdragon 800(Variant)	High-End (800 Series)	Variant for specific modem configurations
MSM8674	Snapdragon 800(Variant)	High-End (800 Series)	Variant for specific modem configurations
MSM8992	Snapdragon 808	Upper Mid-Range (6-core)	Premium devices from 2015-2016
MSM8976	Snapdragon 652	Upper Mid-Range (600 Series)	High-performance mid-range devices
MSM8956	Snapdragon 650	Upper Mid-Range (600 Series)	High-performance mid-range devices

RAM and Package-on-Package (PoP) Support

The stencil specifically accommodates the connections for the memory chips that sit directly on top of the CPU (PoP structure), which is critical for successful reballing:

MSM8976 RAM
MSM8956 RAM
MSM8 (General reference for an 8-series RAM structure)

Key Specifications

Feature	Detail
Model	AMAOE U-QSD1 (Universal-Qualcomm-SnapDragon 1)
Function	BGA Reballing Stencil (植锡, Tin Planting)
Thickness	0.12MM (Standard thinness for precision micro-soldering)
Target Series	Snapdragon 800, 801, 808, 650, 652
BGA Support	BGA153 (A common footprint for eMMC/UFS flash memory chips)
Sticker Description	“高通骁龙800/801/808/650/652, MSM8274/8674/8974/8992/8856/8976 综合网-0.12MM”
Patent	专利产品 ZL2016213989365

Summary

The U-QSD1 is an essential tool for technicians repairing older, premium devices, as it covers the foundational processors of the mid-2010s smartphone era, most notably the highly popular and repair-prone Snapdragon 801 (MSM8974) and the powerful Snapdragon 650/652 series. The inclusion of RAM reballing spots and the BGA153footprint makes it a true comprehensive solution for these chips.

Since the list is the supported chip list, here is the breakdown, showing the specific CPU model and its commercial Snapdragon designation:

Model Number	Type of Chip/Footprint	Commercial Snapdragon Series	Key Devices/Notes
MSM8974	Main SoC (CPU)	Snapdragon 800 / 801	Flagship processor of 2013-2014 era.
MSM8274	Main SoC (CPU)	Snapdragon 800	Variant of 8974 (typically without integrated LTE).
MSM8674	Main SoC (CPU)	Snapdragon 800	Variant of 8974 (supports global CDMA/UMTS).
MSM8992	Main SoC (CPU)	Snapdragon 808	High-end processor (6-core) used in devices like the LG G4.
MSM8976	Main SoC (CPU)	Snapdragon 652	High-performance upper-mid-range processor.
MSM8956	Main SoC (CPU)	Snapdragon 650	High-performance upper-mid-range processor.
MSM8976 RAM	RAM Footprint	Snapdragon 652	The stencil area for the RAM chip that sits on top of the MSM8976 SoC (PoP).
MSM8956 RAM	RAM Footprint	Snapdragon 650	The stencil area for the RAM chip that sits on top of the MSM8956 SoC (PoP).
MSM8	RAM Footprint	Snapdragon 8xx Series	General/grouped memory footprint for the older 8-series.
RAM	General Footprint	N/A	General template for RAM packages.
BGA153	Memory Footprint	N/A	Standard footprint for eMMC flash storage chips.