AMAOE U-MTK4 Stencil: Mid-Range MediaTek CPU & Power IC Expert

AMAOE MTK:4– SUPPORTED ICS, CPU

MT6186W

MT6177W

MT6368W

MT6358VW

MT6357CRV

MT6359P

MT6177MV

BGA254

MT6779V

MT6771V

MT6768

MT6769V

MT6762

MT6761

MT6765V

MT6631N

77645-21

56022

BGA221

MT6360P

77912

77916

300.00

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AMAOE U-MTK4 Stencil: Mid-Range MediaTek CPU & Power IC Expert

 

AMAOE U-MTK4 Stencil: Mid-Range MediaTek CPU & Power IC Expert

 

The AMAOE U-MTK4 BGA Reballing Stencil is a specialized tool designed for the precision repair of a wide range of MediaTek (MTK) CPUs/SoCs and their associated companion chips, focusing on a popular generation of mid-range to high-performance smartphones.

 

Here is a comprehensive product description based on the supported chips:


 

AMAOE U-MTK4 Stencil: Mid-Range MediaTek CPU & Power IC Expert

 

 

Product Headline: High-Compatibility BGA Reballing for Helio G and P Series

 

The AMAOE U-MTK4 Stencil (U-MTK4_钢网) is an indispensable component of the “UBGA-Tin Planting Expert Series,” specifically tailored for mobile phone technicians working with a wide array of MediaTek processors commonly found in devices from 2018 to 2021. It provides highly precise apertures for reballing both the main application processors and essential power and connectivity ICs.

 

 

Key Supported Chips (CPUs & Companion ICs)

 

The stencil covers a versatile range of chips from the MediaTek Helio G-series (Gaming/Performance) and P-series(Power/Efficiency), along with their companion chips:

 

Chip Model Commercial MediaTek Series Function
MT6768 Helio P65 / G80 / G85 Mid-Range SoC
MT6769V Helio G88 / G90 (approx.) Performance Mid-Range SoC
MT6779V Helio P90 / P95 High-Performance SoC
MT6771V Helio P60 / P70 Mid-Range SoC
MT6762 Helio P22 / A22 Entry to Mid-Range SoC
MT6357CRV Power Management IC (PMIC) Core power regulator (often paired with the above CPUs)
MT6358VW Power Management IC (PMIC) Core power regulator
MT6368W Power Management IC (PMIC) Core power regulator
MT6186W RF Transceiver Handles radio frequency signals for cellular/wireless

 

Product Features

 

  • Model: AMAOE U-MTK4
  • Type: Universal BGA Reballing Stencil (UBGA-植锡专家系列)
  • Thickness: 0.12MM (Standard thinness for excellent precision and control during reballing).

     

  • Material: High-quality, durable stainless steel that resists heat and warping, ensuring longevity.

     

  • Compatibility: Features multiple precisely etched footprints on a single stencil, maximizing efficiency by covering a large group of structurally similar MTK chips.

     

  • Purpose: Essential tool for repairing common BGA faults, such as those caused by drops, water damage, or general CPU/PMIC dislodgement, in a wide array of Android smartphones using these MediaTek processors.
Chip Model Commercial MediaTek Series Equivalent Function
MT6779V Helio P90 / P95 High-performance Mid-Range SoC
MT6771V Helio P60 / P70 Mid-Range SoC
MT6768 Helio P65 / G80 / G85 Mid-Range SoC
MT6769V Helio G88 / G90 (approx.) Performance Mid-Range SoC
MT6762 Helio P22 / A22 Entry to Mid-Range SoC
MT6761 Helio A22 Entry-Level SoC
MT6765V Helio P35 / G35 Entry to Mid-Range SoC

 

II. Supporting / Companion ICs

 

These chips are not the main CPU, but are critical auxiliary chips that function with the processors above.

 

A. Power Management (PMIC)

 

Chip Model Function
MT6368W Power Management IC (PMIC)
MT6358VW Power Management IC (PMIC)
MT6357CRV Power Management IC (PMIC)
MT6359P Power Management IC (PMIC)
MT6360P Power Management IC (PMIC)

 

B. RF and Connectivity Chips

 

Chip Model Function
MT6186W RF Transceiver
MT6177W RF Transceiver
MT6177MV RF Transceiver
MT6631N Connectivity (Wi-Fi/Bluetooth/GPS)
77645-21, 77912, 77916 RF Front-End Modules (FEM/PA)
56022 RF/Switching Component

 

C. Universal Memory BGA Footprints

 

Footprint Function
BGA254 Standard footprint for memory chips (e.g., eMMC/UFS).
BGA221 Standard footprint for memory chips (e.g., eMMC/UFS).

 

 

AMAOE U-MTK4 Stencil Product Details

 

 

Primary Focus (CPUs/SoCs)

 

The stencil is designed to reball a wide range of MediaTek’s Helio A, P, and G series processors. The label provides a clear summary:

Chip Model Range Commercial Name (Helio Series) Function / Notes
MT6761V Helio A22 Entry-level SoC
MT6762V Helio P22 / A22 Entry to Mid-Range SoC
MT6765V Helio P35 / G35 Entry to Mid-Range SoC
MT6768V Helio P65 / G80 / G85 Mid-Range Performance SoC
MT6769V Helio G88 (approx.) Performance Mid-Range SoC
MT6771V Helio P60 / P70 Mid-Range SoC
MT6779V Helio P90 / P95 High-Performance SoC

 

Supported Companion and Memory ICs

 

The stencil also includes dedicated footprints for essential chips that are often damaged or need reballing alongside the main CPU:

Component/Model Type Function / Notes
MT6368W, MT6358VW, MT6357CRV, MT6359P, MT6360P Power Management ICs (PMIC) Responsible for regulating power to the SoC and other components.
MT6186W, MT6177W, MT6177MV RF Transceivers Handle cellular and wireless radio signals.
MT6631N Connectivity Chip Likely Wi-Fi, Bluetooth, and GPS functions.
77645-21, 56022, 77912, 77916 RF Front-End Modules (FEM) Power Amplifiers and switches for wireless signal transmission.
BGA254, BGA221 Universal Memory Footprints Standard sizes for reballing eMMC or UFS flash storage chips.

 

Key Specifications

 

Feature Detail
Model AMAOE U-MTK4
Function BGA Reballing Stencil (植锡专家系列)
Thickness 0.12MM (Standard thinness for high-precision micro-soldering)
Target Series MediaTek Helio A22, P22, P40, P60, P65, G80, P90
Patent 专利产品 ZL2016213989365

In summary, the U-MTK4 is a highly versatile and essential stencil for technicians, covering a massive install base of popular Android devices that utilize MediaTek’s P-series and G-series mid-range processors.

 

 

Technical Specifications:

 

  • Material: Stainless Steel
  • Pattern: Square
  • Dimensions (W x H): 10 x 8 cm
  • Thickness: 0.12mm
  • Color: Silver
  • Item Weight: 50 g
  • Country of Origin: China
  • Net Quantity: 1
  • Reusable: Yes

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of  RS 80  will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

Shipping Partner Dtdc Courier

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We Currently Ship Products Only Within India. You Can Place Orders From Across The World But Delivery Addresses Are Restricted To India.

We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com    Or     Call 989533347

Cash On Delivery (Cod) Available

 

Advance Payment Rs 100

COD SHIPPING CHARGE RS150/- ALL INDIA

Thousand Rupees Above Order Full Amount Cod Available

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RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME

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AMAOE U-MTK4 Stencil: Mid-Range MediaTek CPU & Power IC Expert
AMAOE U-MTK4 Stencil: Mid-Range MediaTek CPU & Power IC Expert

300.00

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Qualcomm STENCIL CPU 6 QS12 QiAnLi  × 1 350.00
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