AMAOE U-MTK4 Stencil: Mid-Range MediaTek CPU & Power IC Expert
AMAOE MTK:4– SUPPORTED ICS, CPU
MT6186W
MT6177W
MT6368W
MT6358VW
MT6357CRV
MT6359P
MT6177MV
BGA254
MT6779V
MT6771V
MT6768
MT6769V
MT6762
MT6761
MT6765V
MT6631N
77645-21
56022
BGA221
MT6360P
77912
77916
₹300.00
AMAOE U-MTK4 Stencil: Mid-Range MediaTek CPU & Power IC Expert
The AMAOE U-MTK4 BGA Reballing Stencil is a specialized tool designed for the precision repair of a wide range of MediaTek (MTK) CPUs/SoCs and their associated companion chips, focusing on a popular generation of mid-range to high-performance smartphones.
Here is a comprehensive product description based on the supported chips:
AMAOE U-MTK4 Stencil: Mid-Range MediaTek CPU & Power IC Expert
Product Headline: High-Compatibility BGA Reballing for Helio G and P Series
The AMAOE U-MTK4 Stencil (U-MTK4_钢网) is an indispensable component of the “UBGA-Tin Planting Expert Series,” specifically tailored for mobile phone technicians working with a wide array of MediaTek processors commonly found in devices from 2018 to 2021. It provides highly precise apertures for reballing both the main application processors and essential power and connectivity ICs.
Key Supported Chips (CPUs & Companion ICs)
The stencil covers a versatile range of chips from the MediaTek Helio G-series (Gaming/Performance) and P-series(Power/Efficiency), along with their companion chips:
Product Features
- Model: AMAOE U-MTK4
- Type: Universal BGA Reballing Stencil (UBGA-植锡专家系列)
- Thickness: 0.12MM (Standard thinness for excellent precision and control during reballing).
- Material: High-quality, durable stainless steel that resists heat and warping, ensuring longevity.
- Compatibility: Features multiple precisely etched footprints on a single stencil, maximizing efficiency by covering a large group of structurally similar MTK chips.
- Purpose: Essential tool for repairing common BGA faults, such as those caused by drops, water damage, or general CPU/PMIC dislodgement, in a wide array of Android smartphones using these MediaTek processors.
II. Supporting / Companion ICs
These chips are not the main CPU, but are critical auxiliary chips that function with the processors above.
A. Power Management (PMIC)
B. RF and Connectivity Chips
C. Universal Memory BGA Footprints
AMAOE U-MTK4 Stencil Product Details
Primary Focus (CPUs/SoCs)
The stencil is designed to reball a wide range of MediaTek’s Helio A, P, and G series processors. The label provides a clear summary:
Supported Companion and Memory ICs
The stencil also includes dedicated footprints for essential chips that are often damaged or need reballing alongside the main CPU:
Key Specifications
In summary, the U-MTK4 is a highly versatile and essential stencil for technicians, covering a massive install base of popular Android devices that utilize MediaTek’s P-series and G-series mid-range processors.
Technical Specifications:
- Material: Stainless Steel
- Pattern: Square
- Dimensions (W x H): 10 x 8 cm
- Thickness: 0.12mm
- Color: Silver
- Item Weight: 50 g
- Country of Origin: China
- Net Quantity: 1
- Reusable: Yes
shipping & delivery
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RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME
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