AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL
AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL

AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL

AMAOE QSU:5– SUPPORTED ICS, CPU

SM8350

SM8250

SM8250-102 Small

SM7475

SM8475

SM8425

SM8450

RAM 496

RAM 556

SM8550


₹300.00

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AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL
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AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL

 

AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL

AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL

Product Description: AMAOE Stencil U-QSU5

 

Feature Details
Product Name 钢网 Stencil-U-QSU5 AMAOE Easy Repair® (UBGA – Tinning Expert Series)
Tool Type BGA Reballing Stencil (Steel Mesh)
Purpose To precisely apply solder paste/balls onto the pads of Ball Grid Array (BGA) chips, which is a key step in replacing or repairing mobile phone CPU and RAM components.
Thickness 0.12MM (Indicates a thin, high-precision stencil for small BGA solder balls).
Target Chips Qualcomm Snapdragon (CPU Collection Network) and associated RAM chips.
Supported ICs Snapdragon 8 Gen 2: SM8550
Snapdragon 8+ Gen 1: SM8475 / SM8425
Snapdragon 8 Gen 1: SM8450
Snapdragon 888: SM8350
Snapdragon 865/870: SM8250-002 (Large) / SM8250-102 (Small)
Snapdragon 7+ Gen 2: SM7475
RAM (Memory): RAM 496, RAM 556 (Specific RAM chips often stacked on or paired with these CPUs).
Special Feature Anti-bulging heat dissipation vent design (A feature to help with heat dispersion and stability during the soldering/reballing process).
Patent Patented Product (ZL2016213989365).
Series U-QSU5 (Part of the AMAOE “U-QSU” series for Qualcomm Snapdragon chips).
Intended User Mobile phone repair technicians who perform advanced board-level repairs (Microsoldering).

The items you listed are a mix of official Qualcomm Snapdragon CPU model numbers (SM series) and internal component designations used by the stencil manufacturer (AMAOE) for repair purposes.

Here is the CPU and component supporting list, organized by the Snapdragon generation:

AMAOE Designation Qualcomm Model Snapdragon Family Name General Use (Example Devices)
SM8550 SM8550 Snapdragon 8 Gen 2 Flagship phones released in 2023 (e.g., Samsung Galaxy S23 series, OnePlus 11, Xiaomi 13 series, etc.)
SM8475 SM8475 Snapdragon 8+ Gen 1 High-end phones released in late 2022/early 2023 (e.g., Xiaomi 12S Ultra, ASUS ROG Phone 6, Nothing Phone 2, etc.)
SM8425 SM8425 Snapdragon 8+ Gen 1 Note: This is often considered a variant of the SM8475 for some markets or specific modem configurations.
SM8450 SM8450 Snapdragon 8 Gen 1 Flagship phones released in 2022 (e.g., Samsung Galaxy S22 series, OnePlus 10 Pro, Xiaomi 12 series, etc.)
SM8350 SM8350 Snapdragon 888/888+ Flagship phones released in 2021 (e.g., Samsung Galaxy S21 series, Xiaomi Mi 11, OnePlus 9 series, etc.)
SM8250 SM8250-002 (Large) Snapdragon 865/870 Flagship/High-end phones from 2020-2021 (e.g., Samsung Galaxy S20 series, OnePlus 8 series, various high-end models.)
SM8250-102 Small SM8250-102 Snapdragon 865 Note: This likely refers to a specific, physically smaller variant of the 865 package.
SM7475 SM7475 Snapdragon 7+ Gen 2 High-end mid-range phones released in 2023 (e.g., Xiaomi POCO F5/Redmi Note 12 Turbo).
RAM 496 (Internal BGA designation) RAM (Memory Chip) This refers to a common type of LPDDR/UFS memory BGA package used in conjunction with these CPUs.
RAM 556 (Internal BGA designation) RAM (Memory Chip) This refers to another common type of LPDDR/UFS memory BGA package.

Summary: The AMAOE U-QSU5 stencil is specifically designed for BGA reballing of Qualcomm’s Snapdragon 8-series and the high-performance Snapdragon 7+ Gen 2 chips, covering a wide range of flagship devices from approximately 2020 to 2023. The tool is for board-level repairs where these chips need to be removed, cleaned, have new solder balls applied (tinning or reballing), and then re-soldered onto the logic board.

Technical Specifications:

 

  • Material: Stainless Steel
  • Pattern: Square
  • Dimensions (W x H): 10 x 8 cm
  • Thickness: 0.12mm
  • Color: Silver
  • Item Weight: 50 g
  • Country of Origin: China
  • Net Quantity: 1
  • Reusable: Yes

 

 

 

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of  RS 80  will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

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We Currently Ship Products Only Within India. You Can Place Orders From Across The World But Delivery Addresses Are Restricted To India.

We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com    Or     Call 989533347

Cash On Delivery (Cod) Available

 

Advance Payment Rs 100

COD SHIPPING CHARGE RS150/- ALL INDIA

Thousand Rupees Above Order Full Amount Cod Available

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AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL
AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL

₹300.00

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  • No. 6/429-c (12)
     Land Ship Mall,
     Mavoor Road Junction,
     Kozhikode, Pin - 673001 
  • (+91) 9895333473
Mobileicbinu@gmail.com

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Product Subtotal
Qualcomm CPU+Baseband QSC1110 MSM7227 MSM6246 MDM6600 MSM6260 MDM9600 QSC6270 MDM9215M MDM8215 QSC1105 MSM7521 MSM8909W stencil Mega-Idea  × 1 ₹350.00
Subtotal ₹350.00
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Total ₹430.00

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    product delivery all india 3 to 7 days delivery time dtdc courier

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Subtotal:
₹350.00
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