AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL
AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL

AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL

AMAOE QSU:5– SUPPORTED ICS, CPU

SM8350

SM8250

SM8250-102 Small

SM7475

SM8475

SM8425

SM8450

RAM 496

RAM 556

SM8550


₹300.00

Added to wishlistRemoved from wishlist 0
Add to compare
AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL
Categories: , , Tags: ,

AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL

 

AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL

AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL

Product Description: AMAOE Stencil U-QSU5

 

Feature Details
Product Name 钢网 Stencil-U-QSU5 AMAOE Easy Repair® (UBGA – Tinning Expert Series)
Tool Type BGA Reballing Stencil (Steel Mesh)
Purpose To precisely apply solder paste/balls onto the pads of Ball Grid Array (BGA) chips, which is a key step in replacing or repairing mobile phone CPU and RAM components.
Thickness 0.12MM (Indicates a thin, high-precision stencil for small BGA solder balls).
Target Chips Qualcomm Snapdragon (CPU Collection Network) and associated RAM chips.
Supported ICs Snapdragon 8 Gen 2: SM8550
Snapdragon 8+ Gen 1: SM8475 / SM8425
Snapdragon 8 Gen 1: SM8450
Snapdragon 888: SM8350
Snapdragon 865/870: SM8250-002 (Large) / SM8250-102 (Small)
Snapdragon 7+ Gen 2: SM7475
RAM (Memory): RAM 496, RAM 556 (Specific RAM chips often stacked on or paired with these CPUs).
Special Feature Anti-bulging heat dissipation vent design (A feature to help with heat dispersion and stability during the soldering/reballing process).
Patent Patented Product (ZL2016213989365).
Series U-QSU5 (Part of the AMAOE “U-QSU” series for Qualcomm Snapdragon chips).
Intended User Mobile phone repair technicians who perform advanced board-level repairs (Microsoldering).

The items you listed are a mix of official Qualcomm Snapdragon CPU model numbers (SM series) and internal component designations used by the stencil manufacturer (AMAOE) for repair purposes.

Here is the CPU and component supporting list, organized by the Snapdragon generation:

AMAOE Designation Qualcomm Model Snapdragon Family Name General Use (Example Devices)
SM8550 SM8550 Snapdragon 8 Gen 2 Flagship phones released in 2023 (e.g., Samsung Galaxy S23 series, OnePlus 11, Xiaomi 13 series, etc.)
SM8475 SM8475 Snapdragon 8+ Gen 1 High-end phones released in late 2022/early 2023 (e.g., Xiaomi 12S Ultra, ASUS ROG Phone 6, Nothing Phone 2, etc.)
SM8425 SM8425 Snapdragon 8+ Gen 1 Note: This is often considered a variant of the SM8475 for some markets or specific modem configurations.
SM8450 SM8450 Snapdragon 8 Gen 1 Flagship phones released in 2022 (e.g., Samsung Galaxy S22 series, OnePlus 10 Pro, Xiaomi 12 series, etc.)
SM8350 SM8350 Snapdragon 888/888+ Flagship phones released in 2021 (e.g., Samsung Galaxy S21 series, Xiaomi Mi 11, OnePlus 9 series, etc.)
SM8250 SM8250-002 (Large) Snapdragon 865/870 Flagship/High-end phones from 2020-2021 (e.g., Samsung Galaxy S20 series, OnePlus 8 series, various high-end models.)
SM8250-102 Small SM8250-102 Snapdragon 865 Note: This likely refers to a specific, physically smaller variant of the 865 package.
SM7475 SM7475 Snapdragon 7+ Gen 2 High-end mid-range phones released in 2023 (e.g., Xiaomi POCO F5/Redmi Note 12 Turbo).
RAM 496 (Internal BGA designation) RAM (Memory Chip) This refers to a common type of LPDDR/UFS memory BGA package used in conjunction with these CPUs.
RAM 556 (Internal BGA designation) RAM (Memory Chip) This refers to another common type of LPDDR/UFS memory BGA package.

Summary: The AMAOE U-QSU5 stencil is specifically designed for BGA reballing of Qualcomm’s Snapdragon 8-series and the high-performance Snapdragon 7+ Gen 2 chips, covering a wide range of flagship devices from approximately 2020 to 2023. The tool is for board-level repairs where these chips need to be removed, cleaned, have new solder balls applied (tinning or reballing), and then re-soldered onto the logic board.

Technical Specifications:

 

  • Material: Stainless Steel
  • Pattern: Square
  • Dimensions (W x H): 10 x 8 cm
  • Thickness: 0.12mm
  • Color: Silver
  • Item Weight: 50 g
  • Country of Origin: China
  • Net Quantity: 1
  • Reusable: Yes

 

 

 

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of  RS 80  will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

Shipping Partner Dtdc Courier

Tracking Link

logo

We Currently Ship Products Only Within India. You Can Place Orders From Across The World But Delivery Addresses Are Restricted To India.

We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com    Or     Call 989533347

Cash On Delivery (Cod) Available

 

Advance Payment Rs 100

COD SHIPPING CHARGE RS150/- ALL INDIA

Thousand Rupees Above Order Full Amount Cod Available

Cash On Delivery Availability, Check Your City PinCod  

LINK

Location Finder

RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME

Tracking Link

User Reviews

0.0 out of 5
★★★★★
0
★★★★★
0
★★★★★
0
★★★★★
0
★★★★★
0
Write a review

There are no reviews yet.

Be the first to review “AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL”

Your email address will not be published. Required fields are marked *

AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL
AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL

₹300.00

Add to cart

Need help? Call our award-winning support team 24/7 at +919895333473

Adress

  • Binu Mobiles 
  • No. 6/429-c (12)
     Land Ship Mall,
     Mavoor Road Junction,
     Kozhikode, Pin - 673001 
  • (+91) 9895333473
Mobileicbinu@gmail.com

Quick Links

Products

apple device stencil | mobile phones stencil

© 2022 All rights reserved

Twitter Facebook Dribbble Youtube Pinterest Medium
YOUR CART

Billing details

India

India

Product Subtotal
Note10 5G N975F MIDDLE LAYER STENCIL  × 1 ₹300.00
NOTE 20 /SM-N981U N981N N981O MIDDLE LAYER STENCIL  × 1 ₹300.00
IQ00 10 Middle Layer stencil IQ10 STENCIL  × 1 ₹300.00
MTK CPU stencil MT6595 MT6582 MT6580A MT6589 MT6572A MT6260DA MT6873V MT6732  × 1 ₹350.00
Exynos stencil samsung CPU 2 QS23  × 1 ₹350.00
Subtotal ₹1,600.00
Shipping
Total ₹1,680.00

  • it uses upi apps like bhim, paytm, google pay, phonepe or any banking upi app to make payment.
    if you need any help whatsapp 9895333473
    product delivery all india 3 to 7 days delivery time dtdc courier

Your personal data will be used to process your order, support your experience throughout this website, and for other purposes described in our privacy policy.

Subtotal:
₹1,600.00
Fast Sale Item
UV Universal Stencil | GREEN OIL UV REBALLING NETWORK FILM
UV Universal Stencil | GREEN OIL UV REBALLING NETWORK FILM
Original price was: ₹220.00.Current price is: ₹199.00.
sky58083-11 IC Network IC PA 58083 Mobile phone Power Amplifier IC sky58083 11 Signal Module Chip sky 58083
sky58083-11 IC Network IC PA 58083 Mobile phone Power Amplifier IC sky58083 11 Signal Module Chip sky 58083
Original price was: ₹300.00.Current price is: ₹250.00.
AMAOE PM4450 STENCIL SM-6450 STENCIL
AMAOE PM4450 STENCIL SM-6450 STENCIL
Original price was: ₹281.00.Current price is: ₹280.00.
E8535 CPU STENCIL E8835 SAM18
E8535 CPU STENCIL E8835 SAM18
₹300.00
MT6377W POWER IC FOR REDMI 13c 5G
MT6377W POWER IC FOR REDMI 13c 5G
₹300.00
mobilestencil
Logo
Compare items
  • Total (0)
Compare
0
AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL
AMAOE Stencil U-QSU5 Qualcomm SM8350 SM8350 SM8550 SM8450 STENCIL
- +
₹300.00
5
Shopping cart