X200P STENCIL VIVO X200PRO MIDDLE LAYER STENCIL

X200P STENCIL VIVO X200PRO MIDDLE LAYER STENCIL

AMAOE X200P-012 Reballing Stencil for Vivo X200 Pro

This is a professional-grade reballing stencil from AMAOE, designed for an advanced and highly specific repair scenario: the middle layer of the VIVO X200 Pro motherboard. Crafted with the experience of professional technicians in mind, this patented tool is essential for complex, multi-layer board repairs.

Key Features & Benefits

• Dedicated to Vivo X200 Pro (中层网): This stencil is a precision tool specifically designed for the middle layerof the Vivo X200 Pro’s motherboard. This layer contains critical ICs that are “sandwiched” between the upper and lower boards, and a dedicated stencil is required for a successful repair.
• Strong Magnetic Properties (强磁性): A key innovation, the strong magnetic property allows the stencil to securely and quickly align with a magnetic reballing jig. This prevents any shifting or movement during the application of solder paste, a crucial benefit for the precision required in a middle-layer reballing job.
• Ultra-Precision 0.12mm Thickness: With an optimal thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to the chip’s microscopic pads. This precision is essential for preventing shorts and creating a robust, reliable connection.
• Perfect Dimensions: The stencil’s size is 70x70mm, ensuring it perfectly fits a standard reballing jig while providing ample space for the middle layer’s components.
• Patented Design: The stencil’s core features are protected by a Chinese patent, reinforcing its status as a unique and professionally-developed tool that is made to solve specific repair challenges.

Technical Breakdown

• Model: X200P-012
• Brand: AMAOE (阿毛易修)
• Product Code: 41011669
• Compatible Device: VIVO X200 Pro Motherboard (middle layer)
• Dimensions: 70 x 70 mm
• Thickness: 0.12mm
• Special Features: Strong Magnetic Alignment, Patented Design
• Repair Scenario: This stencil is used to reball the BGA-packaged chips that connect the upper and lower halves of the Vivo X200 Pro’s motherboard, typically to fix issues like boot loops, sudden shutdowns, or a complete lack of power.

• Material: Stainless Steel
• Pattern: Square
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes