AMAOE X100U-012 Reballing Stencil for Vivo X100 Ultra

This is a professional-grade reballing stencil from AMAOE, designed for an advanced and highly specific repair scenario: the middle layer of the Vivo X100 Ultra motherboard. This tool is a perfect example of a product made with the repair professional in mind, offering a precise and reliable solution for a complex repair.

Key Features & Benefits

Dedicated to Vivo X100 Ultra (中层网): This stencil is a precision tool specifically designed for the middle layer of the Vivo X100 Ultra’s motherboard. This layer contains critical ICs that are “sandwiched” between the upper and lower boards, and a dedicated stencil is required for a successful repair.
Strong Magnetic Properties (强磁性): A key innovation, the strong magnetic property allows the stencil to securely and quickly align with a magnetic reballing jig. This prevents any shifting or movement during the application of solder paste, a crucial benefit for the precision required in a middle-layer reballing job.
Ultra-Precision 0.12mm Thickness: With an optimal thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to the chip’s microscopic pads. This precision is essential for preventing shorts and creating a robust, reliable connection.
Perfect Dimensions: The stencil’s size is 70x70mm, ensuring it perfectly fits a standard reballing jig while providing ample space for the middle layer’s components.
Patented Design: The stencil’s core features are protected by a Chinese patent, reinforcing its status as a unique and professionally-developed tool that is made to solve specific repair challenges.

Technical Breakdown

Model: X100U-012
Brand: AMAOE (阿毛易修)
Product Code: 41011725
Compatible Device: Vivo X100 Ultra Motherboard (middle layer)
Dimensions: 70 x 70 mm
Thickness: 0.12mm
Material: Stainless Steel
Pattern: Square
Color: Silver
Item Weight: 30 g
Country of Origin: China
Net Quantity: 1
Reusable: Yes
Special Features: Strong Magnetic Alignment, Patented Design
Repair Scenario: This stencil is used to reball the BGA-packaged chips that connect the upper and lower halves of the Vivo X100 Ultra’s motherboard, typically to fix issues like boot loops, sudden shutdowns, or a complete lack of power.