Features:

• Versatility: Compatible with a wide range of phone brands and chipsets (iPhone, Samsung, MTK, Hisilicon, Qualcomm, etc.).
• Accuracy: Stencils are meticulously created based on original factory drawings, ensuring precise alignment and no missing solder joints.
• High Precision: Cleanly cut stencils with no burrs guarantee consistent mesh hole sizes and prevent solder ball issues.

How to Use:

1. Preparation:

   • Thoroughly clean the affected area on the motherboard or chip.
   • Dry the area completely using an air gun.

2. Green Oil Application:

   • Apply a thin, even layer of curing green oil parallel to the repair area using a blade.
   • Minimize air bubbles during application.

3. Stencil Alignment:

   • Place the green oil stencil (printed side down) precisely over the pads, aligning them with the corresponding pads on the chip/motherboard.

4. UV Curing:

   • Expose the stencil and green oil to UV light (typically emitted by a purple light lamp) for 6-15 seconds. The curing time may vary depending on the green oil thickness.

5. Cleaning:

   • Clean the repaired area with PCB water or alcohol.

6. Final Curing:

   • Re-cure the repaired area with the UV lamp to ensure complete and firm curing.

In essence: This kit provides a quick and efficient solution for repairing damaged solder masks on phone motherboards and chips. The use of stencils ensures accurate and consistent repairs, while the UV curing process solidifies the green oil, restoring the protective solder mask.

Note: This is a general guide. Always refer to the specific instructions provided with the solder mask repair kit for the most accurate and safe usage.