Tensor G3 CPU_Steel mesh Stencil GOOGLE TENSOR G3 STENCIL

Tensor G3 CPU_Steel mesh Stencil GOOGLE TENSOR G3 STENSIL

Technical Specifications

Feature Specification
Brand AMAOE
Model/Series U-Tensor G-G3 (Google Phone CPU Series)
Material High-Grade Stainless Steel
Aperture Shape Precise Square Holes
Application BGA Reballing / Chip-Level Motherboard Repair

 

300.00

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Tensor G3 CPU_Steel mesh Stencil GOOGLE TENSOR G3 STENCIL

Tensor G2/G3/G4 CPU_Steel mesh Stencil

Product Title

AMAOE U-Tensor G3 High-Precision BGA Reballing Stencil (For Google Pixel CPU & IC Repair)

Product Description

Product Overview

The AMAOE U-Tensor BGA Reballing Stencil is a premium-grade, highly precise repair tool specifically engineered for master technicians dealing with Google Pixel CPU and IC chip hardware. Whether you are dealing with device overheating, bootloops, or performing a full motherboard swap, this stencil ensures flawless solder ball alignment on Google’s advanced Tensor processor architecture.

Crafted with AMAOE’s signature attention to detail, it is an essential addition to your micro-soldering workstation.

Key Features & Specifications

  • Custom-Engineered Layout: Specifically mapped out with accurate aperture designs that match the intricate ball grid array (BGA) of Google Phone CPUs and companion chips.

  • Anti-Deformation Laser Technology: Manufactured from high-quality, durable stainless steel. The stencil resists warping, flexing, and heat damage during intensive high-temperature reflow and reballing processes.

  • Square-Hole Aperture Design: Features precision-cut square holes with chamfered edges to prevent solder paste from sticking, ensuring clean, uniform paste deposition and perfect solder balls every single time.

  • Optimal Thickness: Engineered to a precise thickness that prevents solder bridging while providing just the right amount of solder paste for strong, stable connections.

Primary Applications

  • Precise Solder Paste Application: Functions as a perfect mask to apply a controlled, uniform layer of solder paste onto the PCB pads before reflow.

  • IC Reballing: Ideal for completely reworking, lifting, and re-soldering Google Tensor CPUs and integrated circuits (SMDs) back onto the motherboard logic board.

Technical Specifications

Feature Specification
Brand AMAOE
Model/Series U-Tensor G-G3 (Google Phone CPU Series)
Material High-Grade Stainless Steel
Aperture Shape Precise Square Holes
Application BGA Reballing / Chip-Level Motherboard Repair

STENCIL NUMBER: Google Tensor CPU STENCIL G3

 

MODEL NAME: Google Tensor CPU STENCIL G-G3

 

MODEL NUMBER SUPPORT IC & CHIP : Google Tensor CPU STENCIL

 

COMPATIBILITY

 

BRAND:  AMAOE

Google Tensor CPU STENCIL

MODEL:  stencil

 

SIZE:

 

APPLICATION: MOBILE IC REBOLL

 

TYPE: HAND TOOL PARTS

 

ORIGIN: MAINLAND CHINA

 

DELIVERY TIME OF THE PRODUCT:

 

ALL KERALA 2 DAYS ONLY  DTDC COURIER SEND

 

NALL INDIAN

 

INDIAN SPEED POST SENDING 3 TO 7 DAYS DELIVERY TIME

 

SEND MAIL I’D  & WHATSAPP NUMBER TRACKING I’D SEND

 

FOR ANY FURTHER CLARIFICATIONS, PLEASE CONTACT US CALL & WHATSAPP  9895333473

 

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Tensor G3 CPU_Steel mesh Stencil GOOGLE TENSOR G3 STENCIL
Tensor G3 CPU_Steel mesh Stencil GOOGLE TENSOR G3 STENCIL

300.00

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Billing details

India

India

Product Subtotal
Mi 3 stencil QiANLi Mi 5/5S/5S Plus/NOTE2/ MIX MSM8996 CPU QS31  × 1 350.00
Subtotal 350.00
Shipping
Total 430.00
  • it uses upi apps like bhim, paytm, google pay, phonepe or any banking upi app to make payment.
    if you need any help whatsapp 9895333473
    product delivery all india 3 to 7 days delivery time dtdc courier

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Tensor G3 CPU_Steel mesh Stencil GOOGLE TENSOR G3 STENCIL
Tensor G3 CPU_Steel mesh Stencil GOOGLE TENSOR G3 STENCIL
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300.00
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