The Stencil-WSR1 is a specialized tool primarily used for BGA reballing in mobile phone and electronics repair. It is often branded by AMAOE and is designed for specific Integrated Circuits (ICs), particularly those from Qualcomm.

Here are the key product details:

• Type of Tool: BGA (Ball Grid Array) Reballing Stencil or “Tin Planting Mesh.”

   

• Purpose: It is used to precisely apply solder paste or solder balls onto the pads of IC chips (a process called reballing) when removing and then re-soldering the component to a PCB (Printed Circuit Board). This is a common procedure in mobile phone and electronics repair for components like baseband, RF (Radio Frequency), and IF (Intermediate Frequency) chips.

   

• Target ICs/Compatibility (Qualcomm): The WSR-1 is designed for a variety of Qualcomm WTR (Wireless Transceiver) and SDR (Software Defined Radio) ICs. Common supported models include, but are not limited to:

   

  • WTR1620, WTR1625/L, WTR3905/3925, WTR4905/4605, WTR1605/L, WTR5975, WTR2605/2100, WTR2955/2965.

     

  • SDR735, SDR660, SDR8150, SDR845, SDX55M, SDR686, SDR865/868, SMR526.

     

  • It is often described as being for WTR & SDR IC, IF, RF, and WIFI ICs.

     

• Material: Typically made from durable material like stainless steel.

   

• Thickness: Commonly specified as 0.12mm.

   

In essence, the AMAOE WSR-1 stencil is an essential precision tool for technicians performing microsoldering and chip-level repairs on mobile device motherboards that use the listed Qualcomm network and baseband ICs.