Stencil-WSR1 PA IC STENCIL

AMAOE WSR-1 BGA Reballing Stencil Details

Feature	Detail
Brand	AMAOE (阿毛易修®)
Series	Superhard Series (超硬系列)
Model	WSR: 1 (WSR-1)
Purpose	Comprehensive Qualcomm WTR/SDR-IF/RF IC Stencil (Qualcomm高通WTR/SDR-中频/射频IC综合网) for reballing/tin planting.
Thickness	0.12MM
Material/Design	Features a patented design (专利产品：ZL2016213989365) for precision work.
Special Features	Heat Dissipation/Anti-Bulging Design (散热孔防起鼓设计): Prevents the solder paste from bulging or lifting due to heat during the reballing process.
Aperture Types	0.4/45° Angle Holes (0.4/45度孔) and 0.35/45° Angle Holes (0.35/45度孔) along with K-slot holes (锴位孔). This refers to the sizes and the 45-degree angled walls of the openings for better solder ball formation.

Compatible Qualcomm IC Models

The stencil supports a comprehensive list of Qualcomm Wireless Transceiver (WTR) and Software Defined Radio (SDR) chips, which are critical components for a device’s Intermediate Frequency (IF) and Radio Frequency (RF)communications:

WTR Series:
- WTR3905, WTR3925, WFR1620, WTR2605, WTR2100, WTR4905, WTR4605, WTR2955, WTR2965, WFR2600, WTR1625/L, WTR1605/L, WTR5975
SDR Series:
- SDR845, SDX55M, SDR686, SDR865/868, SDR8150, SDR735, SDR660
Other:
- WSR: 1
  
  WTR3905
  
  WTR3925
  
  WFR1620
  
  WTR2605
  
  WTR2100
  
  WTR4905
  
  WTR4605
  
  WTR2955
  
  WTR2965
  
  WFR2600
  
  SMR526
  
  WTR1625/L
  
  SDR845
  
  SDX55M
  
  SDR686
  
  SDR865
  
  SDR868
  
  SDR8150
  
  WTR1605L
  
  0.4/45度孔
  
  0.35/45度孔
  
  WTR5975
  
  SDR735
  
  SDR660

This product is aimed at simplifying the complex process of reworking or replacing these highly integrated chips in mobile phones and other ele

The Stencil-WSR1 is a specialized tool primarily used for BGA reballing in mobile phone and electronics repair. It is often branded by AMAOE and is designed for specific Integrated Circuits (ICs), particularly those from Qualcomm.

Here are the key product details:

Type of Tool: BGA (Ball Grid Array) Reballing Stencil or “Tin Planting Mesh.”
Purpose: It is used to precisely apply solder paste or solder balls onto the pads of IC chips (a process called reballing) when removing and then re-soldering the component to a PCB (Printed Circuit Board). This is a common procedure in mobile phone and electronics repair for components like baseband, RF (Radio Frequency), and IF (Intermediate Frequency) chips.
Target ICs/Compatibility (Qualcomm): The WSR-1 is designed for a variety of Qualcomm WTR (Wireless Transceiver) and SDR (Software Defined Radio) ICs. Common supported models include, but are not limited to:
- WTR1620, WTR1625/L, WTR3905/3925, WTR4905/4605, WTR1605/L, WTR5975, WTR2605/2100, WTR2955/2965.
- SDR735, SDR660, SDR8150, SDR845, SDX55M, SDR686, SDR865/868, SMR526.
- It is often described as being for WTR & SDR IC, IF, RF, and WIFI ICs.
Material: Typically made from durable material like stainless steel.
Thickness: Commonly specified as 0.12mm.

In essence, the AMAOE WSR-1 stencil is an essential precision tool for technicians performing microsoldering and chip-level repairs on mobile device motherboards that use the listed Qualcomm network and baseband ICs.

AMAOE WSR:1 Stencil Supported ICs

IC Type	Model Numbers	Function Category
WTR (Wireless Transceiver)	WTR3905, WTR3925, WTR2605, WTR2100, WTR4905, WTR4605, WTR2955, WTR2965, WTR5975, WTR1625/L, WTR1605/L	Transceiver/RF & IF
SDR (Software Defined Radio)	SDR845, SDX55M, SDR686, SDR865, SDR868, SDR8150, SDR735, SDR660	RF & Baseband
WFR (Wi-Fi/Front-End)	WFR1620, WFR2600	RF/Wi-Fi
SMR (RF Switch/Module)	SMR526	RF Component

Special Hole Design Notes (for Technician Reference):

0.4/45度孔: $0.4 mm$ holes with a $4 5^{\circ}$ angle (for precise solder ball formation).
0.35/45度孔: $0.35 mm$ holes with a $4 5^{\circ}$ angle (for precise solder ball formation).