Stencil-RF RF Amplifier Integrated Network-RF2

The product you’re referring to, “Stencil-RF RF Amplifier Integrated Network-RF2,” appears to be a BGA reballing stencil used in the repair of mobile phone components, specifically RF (Radio Frequency) Power Amplifier (PA) ICsand Network ICs.

Here are the consolidated details, primarily associated with the AMAOE RF-2 stencil (AMAOE is a common brand for these tools):

• Product Type: BGA (Ball Grid Array) Reballing Stencil/Tin Planting Net/Steel Mesh.

   

• Purpose: Used by technicians for the precise reballing (re-soldering) of pins on small BGA-style RF Power Amplifier and Network Integrated Circuit (IC) chips, typically found in mobile phones.

   

• Material: High-quality steel (or stainless steel), designed to be deformation-resistant.

   

• Thickness: Generally 0.12mm.

   

• Key Compatible ICs (Power Amplifier / Network ICs): The RF-2 stencil is designed to support a list of common power amplifier and network ICs, which often includes:
  • 77031
  • QPM5677
  • 53735
  • 78191-11

    58255

    HI6D05

    540 (and likely other similar BGA RF ICs)

In short, the AMAOE RF-2 is a specialized tool for micro-soldering, allowing for the precise application of solder paste (or balls) to repair damaged or replaced Power Amplifier and Network IC chips.