SM7550 STENCIL SN 7550 CPU STENCIL

SM7550 STENCIL SN 7550 CPU STENCIL

AMAOE Snapdragon 7 Gen 3 Reballing Stencil (SM7550)

This is a professional-grade reballing stencil from AMAOE, designed to meet the high-precision demands of modern smartphone repair. Crafted with the experience of professional technicians in mind, this tool is optimized for reballing the Qualcomm Snapdragon 7 Gen 3 (SM7550) chipset.

Key Features & Benefits

• Dedicated Snapdragon 7 Gen 3 Support: This stencil is precisely designed for the SM7550 chipset. Its pattern perfectly matches the chip’s BGA layout, ensuring a seamless and accurate reballing process.
• Strong Magnetic Properties (强磁性): A crucial and innovative feature, the strong magnetic property allows the stencil to securely and quickly align with the magnetic base of a reballing jig. This prevents shifting or movement during the application of solder paste, which is critical for ensuring a perfect result on tiny, high-density pads.
• Anti-Bulging Heat Dissipation Design (散热孔防起鼓设计): This patented feature incorporates specialized heat vents. These vents prevent the stencil and solder paste from deforming during the heating process, ensuring that every solder ball forms uniformly and flawlessly.
• Ultra-Precision 0.12mm Thickness: The stencil’s 0.12mm thickness provides the ideal amount of solder paste for the SM7550’s microscopic pads. This precision is essential for preventing shorts and ensuring a robust connection.
• Patented Design: The stencil’s core features are protected by a Chinese patent, reinforcing its status as a unique and professionally-developed tool.

Technical Specifications:
Material: Stainless Steel
Pattern: Square
Dimensions (W x H):
Thickness: 0.12mm
Color: Silver
Item Weight: 30 g
Country of Origin: China
Net Quantity: 1
Reusable: Yes

Technical Breakdown

• Brand: AMAOE (阿毛易修)
• Product Code: 40003498
• Compatible Chipset: Qualcomm Snapdragon 7 Gen 3 (SM7550)
• Thickness: 0.12mm
• Special Features: Strong Magnetic Alignment, Anti-Bulging Heat Vents, Patented Design
• Compatible Devices: This stencil is designed for devices that utilize the Snapdragon 7 Gen 3,