QSU3 STENCIL SM7150 SM8150 SDM439 SDM845 SM7250 SDM670 SDM710

Product Description: AMAOE U-QSU3 Reballing Stencil

Product Title: AMAOE U-QSU3 Pro Reballing Stencil (0.12mm) – Precision Tool for Qualcomm Snapdragon 855, 845, 765G, 730G, 675, 670, 710, 439 & RAM

Short Description: The AMAOE U-QSU3 is a professional-grade 0.12mm precision reballing stencil, meticulously crafted for a wide range of popular Qualcomm Snapdragon CPUs and their corresponding RAM modules. This tool incorporates an innovative anti-bulging design, guaranteeing uniform and reliable solder connections, which are critical for high-end mobile device repairs.

Key Features & Benefits:

• Advanced Anti-Bulging Design: Unlike traditional stencils, the U-QSU3 features “heat dissipation vents” that prevent solder paste from bulging or deforming during the heating process. This ensures perfectly shaped, uniform solder balls, which are essential for maintaining the integrity of delicate BGA (Ball Grid Array) connections.

• Unrivaled Precision (0.12mm): With an ultra-thin 0.12mm profile, this stencil is engineered for microscopic accuracy. It enables technicians to apply solder precisely to the densely packed pads of modern integrated circuits, reducing the chance of bridging and other common reballing failures.

• Extensive Qualcomm Snapdragon Compatibility: This “Qualcomm – CPU Collection Network” stencil supports a broad range of widely-used Snapdragon CPUs, making it an indispensable tool for mobile repair shops. It includes specific layouts for:

  • Snapdragon 855 (SM8150)

  • Snapdragon 845 (SDM845)

  • Snapdragon 730G (SM7150)

  • Snapdragon 765G (SM7250)

  • Snapdragon 675 (SM6150)

  • Snapdragon 670 (SDM670)

  • Snapdragon 710 (SDM710)

  • Snapdragon 439 (SDM439)

• Dedicated RAM Layout: The stencil also includes a specific pattern for the “RAM556” chip, ensuring it provides a comprehensive solution for repairing both CPUs and their associated memory components.

• Durable & Professional Grade: As part of the “AMAOE Easy Repair” brand, this “Patented Product” is made to a high standard, designed for longevity and repeated use in demanding professional environments.

• Clear Labeling: Each chip pattern is clearly marked, allowing for quick and accurate identification, eliminating guesswork and speeding up the repair workflow.

Why the AMAOE U-QSU3 is an Essential Tool: For technicians who perform BGA reballing on a variety of Android devices, the U-QSU3 is a game-changer. Its specialized design simplifies a notoriously difficult repair process, helping you achieve consistently perfect results on some of the most common and valuable mobile processors. This stencil is part of the “UBGA – Soldering Expert Series, making soldering easier!”

Ideal For:

• Professional mobile phone repair technicians

• Electronics repair shops

• Advanced DIY enthusiasts working on Qualcomm-based devices

Product Title:

Precision Reballing Stencil for Huafang Hisilicon CPUs & QSD ICs – Anti-Bulging Design (Stainless Steel)

Product Summary:

This high-precision stainless steel reballing stencil is engineered for professional mobile device repair. Featuring an innovative anti-bulging design for flawless solder application, this reusable stencil is compatible with a range of Huafang Hisilicon CPUs and QSD-10 ICs. Its durable construction and meticulous design make it an essential tool for technicians seeking to achieve perfect, reliable reballing results.

Key Features & Benefits:

• Anti-Bulging Design: The unique heat dissipation holes are specifically designed to prevent solder paste from bulging during the heating process. This ensures every solder ball is uniform and perfectly shaped, leading to stronger, more reliable connections on your ICs.
• High-Quality Material: Made from robust, corrosion-resistant stainless steel, this stencil is built to last. Its durability allows for repeated use, making it a cost-effective solution for professional repair shops.
• Precision and Compatibility: With a precise square pattern and a thickness of just 0.12mm, it offers exact alignment for delicate reballing tasks. It is specifically compatible with Huafang Hisilicon HI CPUs and QSD: 10 model ICs.
• Reusable and Convenient: Designed for multiple uses, this stencil is easy to clean and maintain, providing long-term value for your repair toolkit.
• Compact Dimensions: With a width of 10 cm and a height of 8 cm, the stencil is compact and easy to handle while providing ample space for its various patterns.

Technical Specifications:

• Material: Stainless Steel
• Pattern: Square
• Dimensions (W x H): 10 x 8 cm
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes

What’s in the Box:

• Pack of 1 High-Precision Reballing Stencil