QSD10 STENCIL SM8350 SM8450 SM8457 SM8425 SM7475 CPU MOBILE STENCIL
item model supporting ic cpu ram pa number
77033D
58080
SDR868
BGA153
WCN6851 WCN6856
77040 77048E
SDR735
SM8350
SM8450
SM8475
SM8425
SM7475
RAM 496
VC7643
QMP5679
SMB1396
PMR735A
PM8350BH 001
PM8450
PM8350C
SC8571
QDM3302
QPA5590
WCD9380
WCD9385
1619A
QET7100
NXP
Qualcomm Snapdragon 888/8Gen1/8+Gen1/8+4G/7+Gen2, SM8350/8450/8475/8425/7475 Integrated Network – 0.12mm
₹300.00
QSD10 STENCIL SM8350 SM8450 SM8457 SM8425 SM7475 CPU MOBILE STENCIL
Compatible CPUs and Components mobile stencil
The “QSD10” designation and the list of numbers (SM8350, SM8450, SM8457, SM8425, SM7475) refer to the specific Qualcomm Snapdragon CPUs and other chips that the stencil is designed to work with. These chipsets are found in various high-end mobile devices and include:
- SM8350: Qualcomm Snapdragon 888 and 888 Plus
- SM8450: Qualcomm Snapdragon 8 Gen 1
- SM8475: Qualcomm Snapdragon 8+ Gen 1
- SM8425: Qualcomm Snapdragon 7 Gen 1
- SM7475: Qualcomm Snapdragon 7+ Gen 2
The text on the stencil includes:
- AMAOE (阿毛易修): The brand name.
- U-QSD10: The model number of the stencil.
- Patented Product (专利产品): This indicates that the design is legally protected.
- Qualcomm Snapdragon Processors: The text lists various compatible Qualcomm Snapdragon CPUs and other related ICs, such as SM8350, SM8450, and SM8475 SM8425 SM7475
- UBGA Stencil Series (UBGA植锡专家系列): This describes the product line.
- 0.12MM: The size of the solder balls this stencil is designed for.
· RF & Connectivity ICs: WCN6851, WCN6856, SDR735, SDR868, BGA153, QDM3302
· Power Management ICs (PMIC): PM8350, PM8350BH, PM8350C, PM8450, PMR735A, SMB1396, SC8571
· Audio & Codec Chips: WCD9380, WCD9385
· Other Support Chips: QMP5679, VC7643, OPA5690, 1619A
Highlights
For QSD10 STENCIL SM8350 SM8450 SM8457 SM8425 SM7475 CPU MOBILE STENCIL CPU STENCIL
Brand AMAOE
Model AMAOE QSD 10 STENCIL M8350 SM8450 SM8457 SM8425 SM7475 CPU STENCIL
item model supporting ic cpu ram pa number
77033D
58080
SDR868
BGA153
WCN6851 WCN6856
77040 77048E
SDR735
SM8350
SM8450
SM8475
SM8425
SM7475
RAM 496
VC7643
QMP5679
SMB1396
PMR735A
PM8350BH 001
PM8450
PM8350C
SC8571
QDM3302
QPA5590
WCD9380
WCD9385
1619A
QET7100
NXP
Qualcomm Snapdragon 888/8Gen1/8+Gen1/8+4G/7+Gen2, SM8350/8450/8475/8425/7475 Integrated Network – 0.12mm
ANTI-BULGING DESIGN OF HEAT DISSIPATION HOLES
HUAFANG HISILICON HI CPU-0.12MM
QSD: 10
HALF-BLOCKING DESIGN
Square Pattern
stainless steel Material
W x H: 10 x 8 cm
Color: silver
Specifications
In The Box
Number of Contents in Sales Package
Pack of 1
Country of Origin China
General
Pattern Square
Material stainless steel
Suitable For Possible Value
Re-usable Yes
Net Quantity 1
Dimensions
Width 10 cm
Height 8 cm
Item Weight 50 g
shipping & delivery
LINK
Location Finder
RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME
Tracking Link
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QSD10 STENCIL SM8350 SM8450 SM8457 SM8425 SM7475 CPU MOBILE STENCIL
₹300.00
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