Stencil – MT8781/SM6225 CPU Universal Series (Superhard, 0.12mm)
Short Description: The AMAOE PAD1 is a professional-grade 0.12mm reballing stencil from the “Superhard Series,” specifically designed for repairing tablets and other devices using the MediaTek MT8781V and Qualcomm SM6225 CPUs. This universal stencil includes patterns for multiple CPUs and companion ICs, making it an essential, all-in-one tool for professional tablet repair.
Key Features & Benefits:
Universal CPU Compatibility: This stencil is a comprehensive solution for tablets using two of the most common CPUs from major manufacturers:
MediaTek MT8781V: A powerful octa-core SoC used in high-end 4G IoT platforms and tablets.
Qualcomm SM6225: A popular chipset for tablets and other mobile devices.
Support for Critical Companion ICs: The stencil includes precision patterns for a wide range of essential chips that work with these CPUs, allowing for comprehensive motherboard repair. These include:
PM6225: A common Power Management IC (PMIC) from Qualcomm.
WCN3988: A Qualcomm IC typically responsible for Wi-Fi, Bluetooth, and GPS connectivity.
MT6366MW: A Power Management IC from MediaTek.
WCD9370: A Qualcomm audio codec responsible for sound and audio signals.
WF-M902B-SSA1: This is likely another wireless or power-related component.
BGA153 & BGA200 Support: The stencil supports standard BGA package types, including BGA153 and BGA200. The BGA153 package is commonly used for eMMC/UFS memory chips, making this stencil useful for both CPU and storage-related repairs.
“Superhard Series” Durability: Made from a rigid, high-quality steel, the stencil is part of the “Superhard Series,” ensuring it resists warping and bending. This durability guarantees consistent and reliable performance for repeated reballing jobs.
Ultra-Precision (0.12mm): The stencil’s 0.12mm thickness provides the perfect amount of solder paste, ensuring that each solder ball is uniform and precisely placed, minimizing the risk of shorts or bridging on tightly packed pads.
MT8781V (MediaTek): This is a main System on a Chip (SoC) from MediaTek, often found in tablets and smart displays. It integrates the CPU, GPU, and other core components onto a single die, making it the brain of the device.
SM6225 (Qualcomm): Also known by its commercial name, Snapdragon 680, this is a powerful and efficient processor used in many mid-range tablets and smartphones.
Companion Integrated Circuits (ICs)
These ICs perform essential functions that support the main CPU:
PM6225 (Qualcomm): This is a Power Management IC (PMIC). Its primary role is to regulate and distribute power to all the different components on the motherboard, including the CPU, memory, and other ICs.
WCD9370 (Qualcomm): This is an audio codec from Qualcomm’s Aqstic family. Its function is to encode and decode audio signals, enabling the device’s speakers, microphones, and headset jack to function. A fault in this chip can cause issues with sound or audio recording.
WCN3988 (Qualcomm): This is a wireless connectivity IC. It manages all wireless communications, including Wi-Fi, Bluetooth, and GPS. Issues with Wi-Fi, Bluetooth pairing, or location services can often be traced back to a faulty connection on this chip.
MT6366MW (MediaTek): This is a Power Management IC (PMIC) from MediaTek. Just like the PM6225, it handles power delivery for the main CPU and other components, specifically in devices with the MT8781V chipset.
WF-M902B-SSA1: The exact function of this IC is less publicly documented, but based on the context of the other chips, it is likely another power, wireless, or RF (radio frequency) component essential for the tablet’s operation.
📌 1. WCN3988
Description: This is likely a Qualcomm Wi-Fi/Bluetooth combo chip. While not explicitly detailed in the search results, components with “WCN” prefixes are typically Qualcomm wireless connectivity modules used for Wi-Fi and Bluetooth functionality in mobile devices.
Function: Provides Wi-Fi and Bluetooth connectivity.
Common Use: Found in smartphones and tablets.
Note: No specific datasheet or detailed technical information was found in the search results.
📌 2. MT6366MW
Description: Believed to be a MediaTek power management IC (PMIC). The search results mention MT6365 and MT6360 variants, but MT6366MW itself isn’t detailed. Components with “MT636” prefixes are typically PMICs from MediaTek.
Function: Manages power distribution, battery charging, and power efficiency in mobile devices.
Common Use: Used in MediaTek-based smartphones and tablets.
Note: The search results did not provide a direct datasheet for MT6366MW, but it may be similar to other MT636x series PMICs.
📌 3. BGA153
Description: BGA153 refers to a Ball Grid Array package with 153 balls. This is a common packaging type for integrated circuits, including PMICs, audio codecs, or other small chips.
Function: Provides electrical connections between the chip and the PCB.
Common Use: Used for compact components in mobile devices.
Note: No specific datasheet was found, but BGA153 is a standard package type.
📌 4. PM6225
Description: Based on the search results, PM-6225 is a LAN magnetic module manufactured by Premier Magnetics, Inc., designed for 10/100 PC Card LAN applications.
Function: Provides signal conditioning and isolation for Ethernet connections.
Common Use: Used in networking equipment or embedded systems with LAN capabilities.
Note: This appears unrelated to power management despite the “PM” prefix. Ensure this matches your intended component.
📌 5. WCD9370
Description: The Qualcomm Aqstic WCD9370 is an audio codec designed for high-quality audio playback and recording in multimedia products.
Key Features:
Built on a 40 nm process.
Supports high dynamic range (HDR) for audio.
Integrates a SoundWire interface and multibutton headset control.
Packaged in a 55-pin wafer-level picoscale package.
Common Use: Found in smartphones and tablets for audio processing.
Datasheet: Available in the search results.
📌 6. MT8781V
Description: The MediaTek MT8781V is a highly integrated system-on-chip (SoC) designed for mobile devices, featuring an octa-core CPU (ARM Cortex-A78 and A55), ARM Mali-G57 GPU, and integrated 5G connectivity.
Key Features:
Process Technology: Not specified, but likely 6nm or 7nm.
CPU: Octa-core (2x Cortex-A78 + 6x Cortex-A55) up to 2.0 GHz.
GPU: ARM Mali-G57.
Memory: Supports LPDDR4X.
Connectivity: 5G (sub-6 GHz and mmWave), Wi-Fi 6, Bluetooth 5.2.
Multimedia: 4K video decoding/encoding, AI processing unit (APU).
Common Use: Smartphones, tablets, IoT devices, and automotive applications.
Datasheet: Available in the search results.
📌 7. SM6225
Description: This is likely a Qualcomm Snapdragon mobile platform (e.g., Snapdragon 600 series). However, the search results did not provide specific details. SM6225 might be a model number for a Qualcomm SoC or PMIC.
Function: Provides processing power, connectivity, and multimedia capabilities for mobile devices.
Common Use: Mid-range smartphones and tablets.
Note: No direct information was found in the search results. Verify with Qualcomm’s official resources.
📌 8. WF-M902B-SSA1
Description: This component is not explicitly covered in the search results. Based on the naming convention, it might be:
A display panel (similar to LM290WW1-SSA1, which is a TFT LCD panel by LG).
Or a module-specific part (e.g., sensor or connector).
Common Use: Could be used in displays or custom hardware.
Note: Without a datasheet, this identification is speculative.
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