HW8 STENCIL HI3680 FOR  Huawei P30/P30 Pro, Mate 20/Mate 20 Pro/20X/20RS, and Honor V20/Magic 2

Description for AMAOE HW:8 Reballing Stencil

Product Title: AMAOE HW:8 Reballing Stencil HI368 for Huawei Kirin 980, Mate 20, and P30 Pro Series (0.12mm)

Short Description: The AMAOE HW:8 is a professional-grade 0.12mm precision reballing stencil, specifically designed to repair and restore Ball Grid Array (BGA) chips on a range of Huawei devices. This stencil is a must-have for technicians working with the Huawei P30, Mate 20, and Honor V20 series, ensuring flawless and reliable solder connections.

Key Features & Benefits:

• Precision Engineering: With an ultra-thin 0.12mm thickness, this stencil provides microscopic accuracy, ensuring precise alignment for delicate reballing tasks on densely packed ICs.
• Targeted Compatibility: Specifically engineered for the Huawei Kirin 980 (Hi3680) CPU and associated components. It is the perfect tool for repairing devices like the Huawei P30 Pro, Mate 20 Pro, Mate 20X, Mate 20 RS, and Honor V20.
• Comprehensive Chip Support: The stencil includes patterns for multiple critical components, including:
  • CPU: Kirin 980 (Hi3680)
  • RAM: CPU RAM (Hi3638)
  • Power & Wireless ICs: P9221, HI1102, BCM43596, HI6363, HI6422
• Durable & Reusable: Crafted from high-quality stainless steel, this stencil is built to withstand repeated use in a professional repair environment. Its robust design makes it a long-term asset for your toolkit.
• Professional Results: By using a dedicated and precise stencil, technicians can achieve a high success rate of planting tin, leading to secure and lasting repairs. This stencil simplifies a complex process, reducing rework time and increasing efficiency.

Why You Need It: The Huawei Kirin 980 chipset is found in many popular flagship phones. When these devices suffer from IC detachment due to drops or overheating, the AMAOE HW:8 stencil provides the exact tool needed to correctly reball the CPU and other critical chips. It’s an indispensable tool for any technician specializing in Huawei device repair.

Package Includes:

• 1x AMAOE HW:8 BGA Reballing Stencil (0.12mm)
  

  Technical Specifications:

   

  • Material: Stainless Steel
  • Pattern: Square
  • Dimensions (W x H): 10 x 8 cm
  • Thickness: 0.12mm
  • Color: Silver
  • Item Weight: 50 g
  • Country of Origin: China
  • Net Quantity: 1
  • Reusable: Yes