HW12 STENCIL HI3690 HI9500 FOR nova6 5G/Yao V30 5G CPU STENCIL

AMAOE HW:12 Pro Reballing Stencil for Huawei Kirin 990 & Companion ICs – BGA153, BGA200, 0.12mm (Superhard Series)

Short Description: The AMAOE HW:12 is a professional-grade 0.12mm reballing stencil from the acclaimed “Superhard series,” expertly engineered for repairing and restoring Ball Grid Array (BGA) chips in high-end Huawei and Honor devices. With a dedicated “half-cut” design to prevent solder overflow and patterns for both the Kirin 990 CPU (Hi3690/HI9500) and critical companion ICs, this stencil is the ultimate tool for technicians who demand precision, reliability, and efficiency.

Key Features & Benefits:

• Universal Kirin 990 Compatibility: This single stencil provides a comprehensive solution for devices powered by the Kirin 990 chipset. It includes patterns for both the Hi3690-V100 CPU and the Hi9500-V100, ensuring it works with both the 4G and 5G variants of the processor.

   

• Wide-Ranging IC Support: In addition to the main CPU, the stencil features patterns for a complete set of crucial companion chips, allowing you to solve a variety of faults:
  • Power Management ICs (PMICs): Hi6DO5, HI6526, Hi6422, HI6405, HI6412.

     

  • Wireless ICs: HI1103 (Wi-Fi/Bluetooth/GPS)

     

  • Other Critical Components: HI6365, and the main CPU’s RAM (Hi3690-V100 RAM).

     

• BGA153 & BGA200 Support: The inclusion of BGA153 and BGA200 patterns expands the stencil’s utility.BGA153 is a standard package type for eMMC (embedded MultiMediaCard) memory chips, which means this tool can be used to reball the device’s main storage, a common repair for data corruption or boot-related issues.

   

• Patented “Half-Cut” Design: The innovative “half-cut” feature physically separates the chip patterns on the stencil, acting as a barrier to “block excess tin” and prevent solder paste from spreading between patterns. This leads to cleaner, more accurate reballing and significantly reduces the risk of shorts or bridging.
• “Superhard” Series Durability: Manufactured from a highly rigid and resilient material, this stencil resists warping and bending, even after repeated exposure to high temperatures. This ensures it maintains its perfect flatness, guaranteeing consistent, professional results with every use.
• Broad Device Compatibility: This stencil is compatible with a range of flagship devices from Huawei and Honor, including the nova6 5G and V30 5G, and other models utilizing the Kirin 990 platform.

   

Specifications:

• Model: AMAOE HW:12
• Series: Superhard Series
• Thickness: 0.12mm

   

• Material: High-quality Stainless Steel
• Supported Package Types: BGA153, BGA200

   

• Compatible Chipsets: Huawei Kirin 990 (Hi3690/Hi9500 CPU)

   

• Special Features: Patented design, half-cut anti-overflow system
• Country of Origin: China
• Package Contents: 1 x AMAOE HW:12 Reballing Stencil

Specifications:

            Model: HW:12

• Thickness: 0.12mmMaterial: Superhard Series Stainless Steel
• Compatibility: Huawei Kirin 990 series (Hi3690/Hi9500 CPUs), compatible ICs, RAM, and devices like nova6 5G and Honor V30 5GDesign: Half-cut and full-cut patterns
• Patented: Yes (Patent # ZL2016213089365)
• Reusable: Yes

• Technical Specifications:

   

  • Material: Stainless Steel
  • Pattern: Square
  • Dimensions (W x H): 10 x 8 cm
  • Thickness: 0.12mm
  • Color: Silver
  • Item Weight: 50 g
  • Country of Origin: China
  • Net Quantity: 1
  • Reusable: Yes

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  What’s in the Box:

   

  • Pack of 1 High-Precision Reballing Stencil