HI3680-8 Reballing Stencil for Huawei Kirin 980 HI3680 Cpu Stencil

Product Title:

AMAOE HI3680-8 Pro Reballing Stencil for Huawei Kirin 980 – 0.12mm with Anti-Bulging Design (Mass-Market Edition)

Short Description: The AMAOE HI3680-8 is a specialized, 0.12mm precision reballing stencil from the trusted “Mass-Market Edition,” engineered for the HiSilicon Kirin 980 (Hi3680) CPU. It is a vital tool for professional mobile device repair, featuring an innovative anti-bulging design for heat vents that ensures perfect solder ball formation. This stencil is a reliable and accurate solution for restoring devices that use this popular chipset.

Key Features & Benefits:

• Dedicated Kirin 980 Support: This stencil is specifically designed for the HiSilicon Kirin 980 (HI3680) CPU, which is found in a variety of flagship Huawei and Honor devices. Its patterns are precisely aligned for the CPU and its associated “upper layer” components, ensuring a perfect fit.
• Patented Anti-Bulging Design: A key innovation of this tool is its patented design that incorporates specialized heat vents. These vents prevent the solder paste from bulging or deforming during the heating process, which is critical for creating perfectly uniform solder balls. This feature significantly increases the success rate of complex reballing tasks.
• Ultra-Precision (0.12mm): Crafted with an ultra-thin 0.12mm thickness, the stencil ensures that the correct amount of solder paste is applied to each microscopic pad. This precision is essential for preventing short circuits and creating strong, clean connections.
• “Mass-Market Edition”: This designation indicates that the stencil is optimized for the most common and widely-repaired variant of the Hi3680 chip, providing a cost-effective and highly effective solution for the everyday repair technician.
• Durable & Reusable: Manufactured from a high-quality material, the stencil is designed to withstand the high temperatures and frequent use of a professional repair environment. Its durability ensures it remains a reliable tool for countless reballing jobs.

   

Technical Breakdown:

• Model: HI3680-8
• Supported CPU: HiSilicon Kirin 980 (HI3680)
• Thickness: 0.12mm

   

• Special Features: Patented Anti-Bulging Design for Heat Vents
• Designation: Mass-Market Edition
• Compatibility: This stencil is compatible with devices that use the Kirin 980 chipset, such as the Huawei P30, P30 Pro, Mate 20, Mate 20 Pro, Mate 20X, Mate 20 RS, and Honor V20.

   

• Application: Ideal for addressing common faults like a non-powering device, boot loops, or other issues related to a detached CPU or compromised solder connections.
• Patented: Yes (Patent # ZL2016213989365)

Technical Specifications:

• Material: Stainless Steel
• Pattern: Square
• Dimensions (W x H): 10 x 8 cm
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes

What’s in the Box:

• Pack of 1 High-Precision Reballing Stencil