F-1.0MM-16X16_Flim UV STENCIL GREEN OIL UV STENCIL FILM

Universal BGA Reballing Stencil – 1.0mm Pitch, 16×16 Grid

This reballing stencil is a precision tool used for applying new solder balls to a BGA-packaged integrated circuit (IC). Its key features are defined by its grid dimensions and the spacing between the solder balls.

1.0mm Pitch (1.0mm 间距): This refers to the distance between the center of one solder ball to the center of an adjacent one. A 1.0mm pitch is a relatively large size, often used for older or less complex chips with a lower density of connections.
16×16 Grid: This specifies the number of rows and columns of solder balls. In this case, the stencil has a 16-by-16 grid, totaling 256 individual solder ball positions.

Product Description

This universal reballing stencil is an essential tool for technicians working with a wide range of electronic components. It is compatible with any IC that has a 1.0mm pitch and a 16×16 BGA layout. The stencil is typically made from high-quality, durable steel that resists warping under heat, ensuring consistent and precise solder application.

Common Applications

While the stencil is universal and not tied to a specific device, it is commonly used for reballing a variety of electronic components, including:

Older generation CPUs or GPUs: Before the high-density chips of today, many processors used a larger pitch and ball count.
Power Management ICs (PMICs): Some power management or wireless charging chips still use a less dense BGA layout.
Microcontrollers or Flash Memory: Certain types of flash memory and microcontrollers can also be found in this package size.

Why a Technician Needs This Stencil

A reballing stencil with a 1.0mm pitch and 16×16 grid is a fundamental tool for any repair professional. It allows for the precise repair of a common type of BGA package, enabling technicians to fix issues like boot loops, sudden shutdowns, or a complete lack of power, which are often caused by a faulty or detached IC.

Net Quantity: 1

FEATURES:

SOLDER MASK REPAIR GREEN OIL UV STENCIL

EACH STENCIL IS PROOFREAD ACCORDING TO THE ORIGINAL FACTORY DRAWINGS TO

ENSURE THAT EVERY SOLDER JOINT MUST NOT BE MISSING, COMPLETELY CONSISTENT WITH PRECISE ALIGNMENT

HIGH PRECISION, NO BURRS, SO THAT EACH OF YOUR MESH HOLES CAN BE OF THE SAME SIZE AND NOT STUCK TIN BALLS

HOW TO USE:

AFTER CLEANING THE MOTHERBOARD OR CHIP PART, DRY IT WITH AN AIR GUN TO KEEP IT DRY

USE A BLADE TO APPLY AN APPROPRIATE AMOUNT OF CURING GREEN OIL PARALLEL TO THE CHIP OR MOTHERBOARD THAT NEEDS TO BE REPAIRED

PAY ATTENTION TO APPLYING THE GREEN OIL AS EVENLY AS POSSIBLE, THE THINNER THE COATING, THE BETTER, TRY NOT TO HAVE AIR BUBBLES WHEN LAMINATING

THEN PUT THE GREEN OIL STENCIL (THE PRINTED SIDE) DOWN AGAINST THE PADS, AND THE PADS ON THE GREEN OIL NET ARE ALIGNED WITH THE PADS ON THE CHIP OR THE MOTHERBOARD.

ACCORDING TO THE THICKNESS OF THE APPLIED GREEN OIL, IT IS CURED BY THE PURPLE LIGHT EMITTED BY THE PURPLE LIGHT LAMP FOR 6-15 SECONDS

CLEAN THE PAD PART WITH PCB WATER OR ALCOHOL, AND THEN CONTINUE TO USE THE CURING LAMP TO CURE IT FIRMLY, THAT IS, COMPLETE THE QUICK REPAIR OF THE CHIP OR MOTHERBOARD PAINT DROP