E8855 CPU STENCIL AMAOE EXYNOS1580/SAMSUNG E8855 STENCIL
E8855 CPU STENCIL AMAOE EXYNOS1580/SAMSUNG E8855 STENCIL

E8855 CPU STENCIL AMAOE EXYNOS1580/SAMSUNG E8855 STENCIL

E8855 CPU STENCIL AMAOE EXYNOS1580/SAMSUNG E8855 STENCIL

AMAOE 0.12MM CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOS 1580

PACKAGE INCLUDES:
1 X STENCIL

 

₹300.00

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E8855 CPU STENCIL AMAOE EXYNOS1580/SAMSUNG E8855 STENCIL
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E8855 CPU STENCIL AMAOE EXYNOS1580/SAMSUNG E8855 STENCIL

 

E8855 CPU STENCIL AMAOE EXYNOS1580/SAMSUNG E8855 STENCIL

E8855 CPU STENCIL AMAOE EXYNOS1580/SAMSUNG E8855 STENCIL

 

 

 

 

  • High-quality BGA rework stencil for Exynos 1580 and Samsung E8855 chipset repair and maintenance.

  • Professional-grade AMAOE stencil for accurate solder ball alignment in Samsung processor reballing.

  • Durable stainless steel stencil for Exynos 1580 / E8855 IC chip repair and reballing applications.

  • Perfect tool for mobile motherboard technicians working on Samsung E8855 and Exynos 1580 chips.

  • Laser-cut precision stencil ensures stable and accurate solder paste placement for BGA rework.

  • Ideal for chip-level repair shops handling Samsung Exynos 1580 mobile processor repairs.

  • Easy-to-use stencil for professional smartphone motherboard IC restoration work.

  • Designed for high-accuracy BGA reballing in Samsung E8855 and Exynos 1580 chipsets.

  • Essential repair tool for mobile technicians performing advanced Samsung motherboard IC repairs.

 

 

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E8855 CPU STENCIL AMAOE EXYNOS1580/SAMSUNG E8855 STENCIL
E8855 CPU STENCIL AMAOE EXYNOS1580/SAMSUNG E8855 STENCIL

₹300.00

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EMMC stencil EMCP stencil QS72  × 1 ₹350.00
Subtotal ₹350.00
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Subtotal:
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