AMAOE U-SMG5 Stencil: Samsung Exynos Flagship CPU & PMIC Expert
U-SMG5 STENCIL Qualcomm CP
W9020
78217
MAX77705C/F
QPM5825
SM3080
SMR526
2144JB3
KM9521096
BGA153
SHANNON-A5123
SHANNON5510
SAMSUNG S5520
RAM 496
Exyons2100
Exyons2200
E9925
Exyons990
S5200A
S5311
TN2145
SPS25
SPS26
KM049
A9140
78105
77098
58083-11
₹300.00
AMAOE U-SMG5 Stencil: Samsung Exynos Flagship CPU & PMIC Expert
AMAOE U-SMG5 Stencil: Samsung Exynos Flagship CPU & PMIC Expert
Product Overview
The AMAOE U-SMG5 Stencil (U-SMG5_钢网) is a precision reballing stencil from the “UBGA-Tin Planting Expert Series” (UBGA-植锡专家系列). It is specifically engineered to support the reballing of several generations of high-performance Samsung Exynos SoCs and their custom companion chips (PMICs and RF modules).
- Model: AMAOE U-SMG5
- Thickness: 0.12MM (Standard professional thinness for highly accurate solder paste or ball application).
- Target Series: Exynos 990, Exynos 2100, Exynos 2200, E9925 (These chips power Samsung’s flagship Galaxy S and Note devices).
- Material: High-quality stainless steel, ensuring durability and resistance to heat warpage.
- Patent: ZL2016213989365 (Indicating a patented product design).
Key Supported Processors (CPUs/SoCs)
The stencil is designed to reball the following flagship Samsung processors:
Supported Companion ICs and Footprints
This stencil is comprehensive, including patterns for many custom Samsung Power Management and RF components:
Power Management & Connectivity ICs
RF and Modem Components
Universal Memory Footprints
Summary of Use
The AMAOE U-SMG5 is the dedicated tool for complex microsoldering repairs on Samsung’s recent flagship chips. The combination of CPU, 5G Modem (Shannon), and critical custom PMIC footprints makes it essential for repairing power faults and “no power” issues on devices using the Exynos 990, 2100, and 2200 series.
CPU / SoC Models (The Flagship Processors)
These are the primary Samsung Exynos Application Processors (AP) that the stencil is designed to reball:
II. Supporting / Companion ICs
These chips handle power, modem communication, and RF signal processing, and are essential for the CPU to function.
A. Power Management ICs (PMICs)
These are custom Samsung or partner power chips critical for the phone’s operation:
B. RF and Modem Components
These chips handle the 5G/4G connectivity for the Exynos SoCs:
C. RAM and Auxiliary Components
Technical Specifications:
- Material: Stainless Steel
- Pattern: Square
- Dimensions (W x H): 10 x 8 cm
- Thickness: 0.12mm
- Color: Silver
- Item Weight: 50 g
- Country of Origin: China
- Net Quantity: 1
- Reusable: Yes
shipping & delivery
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RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME
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