AMAOE U-SMG1 Stencil: Exynos 8895 7580 3475 7570 CPU STENCIL

Name: AMAOE U-SMG1 Stencil: Exynos 8895 7580 3475 7570 CPU STENCIL - mobilestencil
Price: 300.00 INR
Availability: InStock

AMAOE U-SMG1 Stencil: Exynos High-End & Legacy Mid-Range Expert

Product Overview

The AMAOE U-SMG1 Stencil (U-SMG1_钢网) is a professional-grade reballing tool from the “UBGA-Tin Planting Expert Series” (UBGA-植锡专家系列). It is specifically designed to support microsoldering repairs on a crucial generation of Samsung Exynos Application Processors (AP) and their corresponding partner chips.

Model: AMAOE U-SMG1
Thickness: 0.12MM (Standard professional thinness for highly accurate solder work).
Target Series: Exynos 8895 (Flagship) and Exynos 7570/7580/3475 (Mid-Range/Budget).
Material: High-quality stainless steel, ensuring durability and heat resistance.
Patent: ZL2016213989365 (Indicating a patented product design).

Key Supported Processors (CPUs/SoCs)

The stencil covers both the flagship and budget ends of the market from that generation, including dedicated footprints for the CPU and its stacked RAM layer:

Exynos Chip Model	Associated RAM Footprint	Function / Notes
Exynos8895	Exynos8895 RAM	Flagship SoC (e.g., Galaxy S8/Note 8 – Exynos variants)
Exynos7580	N/A	Mid-Range SoC (e.g., Galaxy J7)
Exynos7570	N/A	Budget SoC (e.g., Galaxy J5/A3)
Exynos3475	N/A	Legacy Budget SoC (e.g., Galaxy J2)

Supported Companion ICs and Footprints

The stencil is comprehensive, including patterns for many custom Samsung Power Management (PMIC) and Radio Frequency (RF) components:

Power Management & Audio ICs

Chip Model	Function / Notes
MAX778655	PMIC (Primary Samsung Power Management IC)
CS47L93	Audio Codec (Likely Cirrus Logic – responsible for audio processing)
605HP5	PMIC/Auxiliary (Additional power or logic control chip)

RF and Connectivity Chips

Chip Model	Function / Notes
SHANNON955	Shannon Modem/RF (Samsung’s older internal modem/RF module)
QM78038	RF Front-End Module (FEM) (Likely Qorvo/Qualcomm component for signal processing)
77759-51	RF Front-End Module (FEM) (Power Amplifier/Switch)
AFEM-9060	RF Front-End Module (FEM) (Power Amplifier/Switch)
4015B1, VJ51D	Auxiliary/Other (Various supporting ICs like control or sub-switches)

Universal Memory Footprints

Footprint	Function / Notes
BGA221	Universal Memory Footprint (For UFS/eMMC memory chips).
BGA153	Universal Memory Footprint (For UFS/eMMC memory chips).

Summary of Use

The AMAOE U-SMG1 is a critical tool for service centers, covering both the powerful Galaxy S8/Note 8 generation and the massive installed base of older Galaxy A-series and J-series phones, allowing for efficient repair of CPU/RAM, power, and RF-related faults.

I. Main CPU / SoC Models (The Processors) and Associated Phones

Exynos Chip Model	Mobile Phone Models (Examples)	Series Category
Exynos8895	Samsung Galaxy S8, S8+, Note 8 (Exynos variants)	Flagship (2017)
Exynos7580	Samsung Galaxy J7 (2015), Galaxy A7 (2016)	Mid-Range
Exynos7570	Samsung Galaxy J5 (2017), Galaxy A3 (2017), Galaxy J2 Prime	Budget / Mid-Range
Exynos3475	Samsung Galaxy J2, Galaxy Grand Prime VE	Entry-Level / Budget

II. Supporting / Companion ICs

These chips are the key supporting components also covered by the stencil, often found in the mobile models listed above:

A. Power Management & Audio ICs

Chip Model	Function / Notes
MAX778655	PMIC (Primary Samsung Power Management IC)
605HP5	PMIC/Auxiliary (Additional power or logic control chip)
CS47L93	Audio Codec (Cirrus Logic – responsible for audio processing)

B. RF and Modem Components

Chip Model	Function / Notes
SHANNON955	Shannon Modem/RF (Samsung’s older internal modem/RF module)
QM78038, AFEM-9060, 77759-51	RF Front-End Modules (FEM/PA) (Power Amplifiers and switches)

C. RAM and Universal Footprints

Component/Footprint	Type	Function / Notes
Exynos8895 RAM	RAM Footprint (For the stacked memory on the 8895)
BGA221, BGA153	Universal Memory Footprints (For UFS/eMMC memory chips)
4015B1, VJ51D	Auxiliary/Other (Various supporting ICs)

Technical Specifications:

Material: Stainless Steel
Pattern: Square
Dimensions (W x H): 10 x 8 cm
Thickness: 0.12mm
Color: Silver
Item Weight: 50 g
Country of Origin: China
Net Quantity: 1
Reusable: Yes

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of RS 80 will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

Shipping Partner Dtdc Courier

Tracking Link

We Currently Ship Products Only Within India. You Can Place Orders From Across The World But Delivery Addresses Are Restricted To India.

We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com Or Call 989533347

Cash On Delivery (Cod) Available

Advance Payment Rs 100

COD SHIPPING CHARGE RS150/- ALL INDIA

Thousand Rupees Above Order Full Amount Cod Available

Cash On Delivery Availability, Check Your City PinCod

LINK

Location Finder

RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME

Tracking Link

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Product	Subtotal
Mi 3 stencil QiANLi Mi 5/5S/5S Plus/NOTE2/ MIX MSM8996 CPU QS31 × 1	₹350.00
Subtotal	₹350.00
Shipping	Flat rate: ₹80.00
Total	₹430.00

AMAOE U-SMG1 Stencil: Exynos 8895 7580 3475 7570 CPU STENCIL

AMAOE SMG1– SUPPORTED ICS, CPU

MAX778655

QM78038

SHANNON955

BGA221

BGA153

4015B1

AFEM-9060

VJ51D

Exynos8895 RAM

Exynos8895

Exynos7580

Exynos3475

77759-51

605HP5

CS47L93

Exynos7570

AMAOE U-SMG1 Stencil: Exynos 8895 7580 3475 7570 CPU STENCIL

AMAOE U-SMG1 Stencil: Exynos High-End & Legacy Mid-Range Expert

Product Overview

Key Supported Processors (CPUs/SoCs)

Supported Companion ICs and Footprints

Power Management & Audio ICs

RF and Connectivity Chips

Universal Memory Footprints

Summary of Use

I. Main CPU / SoC Models (The Processors) and Associated Phones

II. Supporting / Companion ICs

A. Power Management & Audio ICs

B. RF and Modem Components

C. RAM and Universal Footprints

Technical Specifications:

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of RS 80 will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

Shipping Partner Dtdc Courier

We Currently Ship Products Only Within India. You Can Place Orders From Across The World But Delivery Addresses Are Restricted To India.

We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com Or Call 989533347

Cash On Delivery (Cod) Available

Advance Payment Rs 100

COD SHIPPING CHARGE RS150/- ALL INDIA

Thousand Rupees Above Order Full Amount Cod Available

Cash On Delivery Availability, Check Your City PinCod

RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME

User Reviews

Be the first to review “AMAOE U-SMG1 Stencil: Exynos 8895 7580 3475 7570 CPU STENCIL” Cancel reply

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