AMAOE U-SCU1 BGA Reballing Stencil (Spreadtrum/UNISOC CPU Collection)

AMAOE SCU:1– SUPPORTED ICS, CPU

SC7727S

SC7730S

SC7731C

SC7715A

SC7731G

SC9832A

SC9830A

SC7730A

SC8830A

SC8825C

SC6825A

SC8825A

300.00

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AMAOE U-SCU1 BGA Reballing Stencil (Spreadtrum/UNISOC CPU Collection)

 

AMAOE U-SCU1 BGA Reballing Stencil (Spreadtrum/UNISOC CPU Collection)

AMAOE U-SCU1 BGA Reballing Stencil (Spreadtrum/UNISOC CPU Collection)

 

 

Product Overview

 

The AMAOE Stencil-U-SCU1 (U-SCU1) is a high-precision, dedicated BGA (Ball Grid Array) reballing stencilfrom the patented UBGA-植锡专家系列 (UBGA – Solder Paste Expert Series). It is specifically designed for the professional repair and reballing of a wide range of Spreadtrum (now UNISOC) CPU and IC chips used primarily in budget and entry-level mobile devices. Its core purpose is to make the difficult reballing process simpler and more precise.

 

 

Key Features and Specifications

 

  • Model: Stencil-U-SCU1 / U-SCU1

     

  • Application: BGA Rework/Reballing for SPREADTRUM/UNISOC CPUs.

     

  • Material: High-quality steel mesh/stencil (often Japanese steel sheet).

     

  • Thickness: 0.12MM – The ideal thinness for precise solder ball formation.

     

  • Patented Design: ZL2016213989365
  • Special Feature: 散热孔防起鼓设计 (Heat dissipation hole anti-bulging design) – This innovative design prevents the stencil from warping or lifting (bulging) when heated during the reballing process, ensuring perfect alignment.
  • Hole Type: Features a high-precision pattern of apertures (holes) that are often Square Round Hole designed for accurate and consistent application of solder paste/balls.

     

  • Advantage: Deformation-resistant material and precise pin location for enhanced reliability.

     

 

Compatible Chip Models

 

This single stencil combines the templates for a large collection of Spreadtrum/UNISOC processors:

  • SC7727S

     

  • SC7730S / SC7730A

     

  • SC7731C / SC7731G

     

  • SC7715A

     

  • SC9832A / SC9830A

     

  • SC8830A

     

  • SC8825C / SC8825A

     

  • SC6825A

     

 

Manufacturer Philosophy

 

  • Brand: AMAOE (阿毛易修®)

The CPUs listed (SC7727S, SC7730S, SC7731C, SC7715A, SC7731G, SC9832A, SC9830A, SC7730A, SC8830A, SC8825C, SC6825A, SC8825A) are all older entry-level or budget-category System-on-Chips (SoCs) manufactured by Spreadtrum (now known as UNISOC).

These chips were widely used globally in the following types of devices:

 

CPU IC Supporting Model Categories

 

Category Typical Device Examples and Purpose Key Chip Examples
Budget Android Smartphones (3G/4G) Entry-level smartphones, often sold in developing markets. Used in devices focused on basic communication, browsing, and light social media. SC7731C, SC7731G, SC9830A, SC9832A
Feature Phones (Smart/KaiOS) Devices like the Nokia 3310 3G or other “smart feature phones” that require a low-power chipset with basic connectivity. SC7731E (related to the 77xx series)
Budget Tablets (3G/4G Calling) Inexpensive Android tablets, particularly those with SIM card slots supporting voice calling and mobile data. SC7731 series, SC9832A
Wearable & IoT Some of the smaller and lower-power chips in this family (like the SC7715A) were designed for basic connected devices, although they are primarily known for mobile use. SC7715A
Older/Legacy Budget Models (2G/3G) Very old or extremely low-cost devices from brands like Samsung (Galaxy Star, Galaxy J series), Huawei (Honor Bee), Lava, Intex, and other regional brands. SC7727S, SC7730S, SC8825, SC8830

 

Specific Examples of Supported Devices (General)

 

Since the list is a collection of CPUs across many generations and markets, a comprehensive list is difficult, but the chips were used in devices such as:

  • Samsung: Galaxy J1 Mini Prime, Galaxy J3 (2016), Samsung Z1/Z2 (Tizen OS phones)
  • LYF: Flame 7, Flame 7s
  • Archos: Various Access and Neon series phones/tablets
  • Intex/Micromax/Lava: Various Aqua, Spark, and Bharat budget series phones
  • Various ODM/White-Label Devices: Numerous unbranded or regionally branded phones and tablets globally.

In summary, the AMAOE U-SCU1 stencil is a collective tool for technicians to repair the CPUs of a very large installed base of older, budget-friendly Android and 3G/4G calling tablet devices.

 

 

 

The U-SCU1 stencil is a master collection of patterns for many older, entry-level Spreadtrum/UNISOC chips, which were widely used globally in budget Android phones and tablets, often from regional or emerging brands.

Because these chips were used in hundreds of different, lower-cost models over several years, a single, exhaustive list is impractical. However, I can provide a list of common brands and specific examples associated with these chip series, particularly the more modern ones like SC983x and SC773x:

 

Specific Mobile Model Examples

 

Chip Model Associated Mobile Models (Examples) Brand Type Connectivity
SC9832A Intex Aqua series, Micromax Bharat 2, Archos Access 40, various Cherry Mobile and iVooMi phones. Budget/Regional 4G LTE
SC9830A Samsung Galaxy J1 mini Prime, Samsung Galaxy J3 (2016), LYF Flame 7 / 7s, Philips S326. Budget/Mainstream 4G LTE
SC7731G / C / S Samsung Galaxy J3 (2016) J320H/F (3G versions), Motorola Moto E (1st Gen) (some variants), various budget 3G tablets and phones (e.g., Tecno, itel). Budget/Mainstream 3G
SC7727S / SC7715A Older or very low-end smartphones and 3G feature phones from brands like Karbonn, Lava, and Spice. Low-end/Regional 3G
SC88xx / SC68xx Very old, often 2G/3G-only smartphones from the early-to-mid 2010s, typically used by regional Chinese and Indian manufacturers. Legacy/Low-end 2G/3G

In short: If a technician needs to reball a CPU chip on a budget Android phone or tablet released roughly between 2014 and 2018 that supports 3G or basic 4G, and the CPU has the SPREADTRUM/UNISOC logo, this U-SCU1 stencil is likely the correct tool for the job.

 

 

 

 

Technical Specifications:

 

  • Material: Stainless Steel
  • Pattern: Square
  • Dimensions (W x H): 10 x 8 cm
  • Thickness: 0.12mm
  • Color: Silver
  • Item Weight: 50 g
  • Country of Origin: China
  • Net Quantity: 1
  • Reusable: Yes

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of  RS 80  will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

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Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

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We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com    Or     Call 989533347

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AMAOE U-SCU1 BGA Reballing Stencil (Spreadtrum/UNISOC CPU Collection)
AMAOE U-SCU1 BGA Reballing Stencil (Spreadtrum/UNISOC CPU Collection)

300.00

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Product Subtotal
SM7550 STENCIL SN 7550 CPU STENCIL  × 1 300.00
EMMC stencil EMCP stencil QS72  × 1 350.00
Samsung Stencil Snapdragon 710 SDM710/ Exynos 7904 J720/A305/G8870/G887/A40S/8S  × 1 350.00
Subtotal 1,000.00
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