AMAOE U-QSD9 Stencil SM 8250 SM8250 (Qualcomm Snapdragon 865/870 Flagship Collection)

AMAOE U-QSD9 BGA Reballing Stencil (Qualcomm Snapdragon 865/870 Flagship Collection)

Product Overview

The AMAOE Stencil-U-QSD9 (U-QSD9) is a high-precision, dedicated BGA (Ball Grid Array) reballing stencilfrom the patented UBGA – Soldering Expert Series. This stencil is specifically designed for the professional rework and reballing of the Qualcomm Snapdragon 865 and 870 flagship processors, along with their crucial support ICs, including 5G modems, power management chips, and associated RAM.

Key Features and Specifications

• Model: Stencil-U-QSD9 / U-QSD9 (V2.0)
• Brand: AMAOE Easy Repair®
• Application: BGA Rework/Reballing for high-end Qualcomm Snapdragon CPUs, PMICs, and associated components.
• Marketing Focus: Marketed as the “Qualcomm Snapdragon 865/870, SM8250 Integrated Network.”
• Thickness: 0.12MM—Ensures optimal solder ball formation for high-density, complex ICs.

   

• Patented Design: ZL2016213989365
• Included Variants: Provides both “Large” and “Small” patterns for the main SM8250 CPU, accommodating different PCB layouts or package types.
• Slogan: Tools made with the repairman’s experience in mind / making soldering easier!

Compatible Qualcomm Components (CPU/Modem/PMIC/RAM)

This stencil covers the core chipsets of many 2020-2022 Android flagship and enthusiast phones:

This stencil is a comprehensive solution for technicians specializing in the complex, modular architecture of the Snapdragon 865/870 generation.

Technical Specifications:

• Material: Stainless Steel
• Pattern: Square
• Dimensions (W x H): 10 x 8 cm
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes