AMAOE U-QSD8 Stencil SM 7450 6225 7350 7315 7325(Qualcomm Snapdragon 7/6 Series

AMAOE U-QSD8 BGA Reballing Stencil (Qualcomm Snapdragon 7/6 Series & PMIC Collection)

Product Overview

The AMAOE Stencil-U-QSD8 (U-QSD8) is a multi-chip, high-precision BGA (Ball Grid Array) reballing stencilfrom the patented UBGA – Soldering Expert Series. This tool is essential for professional mobile technicians, as it consolidates the reballing patterns for numerous popular Qualcomm Snapdragon CPUs (SoCs), Power Management ICs (PMICs), RF Transceivers, and connectivity chips that power the mid-range to high-end Android market from approximately 2020 onward.

Key Features and Specifications

• Model: Stencil-U-QSD8 / U-QSD8
• Brand: AMAOE Easy Repair®
• Application: BGA Rework/Reballing for a large collection of Qualcomm Snapdragon CPUs, PMICs, and associated components.
• Thickness: 0.12MM—The standard thinness for accurate and consistent solder ball formation on modern, high-density ICs.
• Material: High-quality steel mesh/stencil.
• Patented Design: ZL2016213989365
• Marketing Focus: Marketed as the “Qualcomm Snapdragon 7Gen1/680/775G/778G, SM7450/6225/7350/7315/7325 Integrated Network.”
• Slogan: Tools made with the experience of repair professionals in mind / making soldering easier!

Compatible Qualcomm Components (CPU/PMIC/RF)

The U-QSD8 is highly comprehensive, covering four main categories of chips:

1. Snapdragon SoCs (CPUs)

These are the main processors for the device:

• SM7450 (Snapdragon 7 Gen 1)
• SM7350 (Snapdragon 778G)
• SM7325 (Snapdragon 778G+ / 778G 5G)
• SM7315 (Snapdragon 775G – often associated with the 778G series)
• SM6225 (Snapdragon 680 / 685)

2. Power Management ICs (PMICs)

These chips manage power distribution, battery charging, and voltage regulation for the CPU and other systems:

• PM8350B (Often paired with high-end chips like the SD 8 Gen series, possibly for secondary power management)
• PM7350 / PM7350C
• PM7325 / PM7325B
• PM6225

3. RF & Connectivity Chips

These handle wireless functions, cellular signals, and audio:

• WCD9380 / WCD9370 (High-quality Audio Codec ICs)

   

• WCN6750 / WCN6740 / WCN3950 (Wi-Fi/Bluetooth/FM Connectivity ICs)
• SDR868 (Snapdragon 5G/4G RF Transceiver)
• SDR735 (RF Transceiver)
• WTR2965 (Older RF Transceiver for mid-range 4G/LTE)
• QPM5577 / QFM2340 (RF Front-End Modules, or power amplifiers)

4. Package Types and Miscellaneous

• BGA254 / BGA297: These are standard BGA pinout counts/sizes, indicating compatibility with various other chips of these dimensions.

This stencil is an indispensable tool for repairing the core components of the current generation of popular mid-range to upper-mid-range Android smartphones.

Primary Snapdragon SoCs (CPUs) and Supported Models

Supporting ICs and their Role in Mobile Devices

The remaining chips are auxiliary components used in conjunction with the CPUs listed above. If a phone contains one of the listed CPUs, it is highly likely to contain the corresponding PMICs, Audio Codecs, and RF chips from this stencil.

In summary: The AMAOE U-QSD8 stencil is a critical tool for technicians repairing the most common and recent line of Qualcomm-based mid-range and high-end 4G/5G Android smartphones from major global manufacturers (Samsung, Xiaomi, OPPO, etc.).

Technical Specifications:

• Material: Stainless Steel
• Pattern: Square
• Dimensions (W x H): 10 x 8 cm
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes