AMAOE U-QSD7 BGA Reballing Stencil, which is designed for mobile phone repair, specifically targeting a wide range of Qualcomm Snapdragon CPUs and associated power management, modem, and RF chips.
The stencil is a “Universal-Qualcomm-SnapDragon 7-series” focused template, made from a 0.12mm thin metal sheet, which is the standard thickness for precision reballing.
Here is the supporting list of chips, grouped by their function:
These are the main Snapdragon chips supported by the stencil, spanning the Snapdragon 400, 600, and 700 series(mostly mid-range and upper-mid-range devices).
Qualcomm Model
Commercial Name(s)
Notes
SM7225
Snapdragon 750G 5G
Mid-range 5G processor.
SM6375
Snapdragon 695 5G
Mid-range 5G processor.
SM6350
Snapdragon 690 5G
Early mid-range 5G processor.
SM4375
Snapdragon 480+ 5G
Entry-level 5G processor.
SM7125
Snapdragon 720G
Upper mid-range 4G gaming processor.
SM4250
Snapdragon 460
Entry-level 4G processor.
SM6115
Snapdragon 662
Mid-range 4G processor.
SM7250
Snapdragon 765G
Mid-range 5G processor.
SDR865
Snapdragon 865
(Note: Although an 8-series chip, it may be included for certain auxiliary chip reballing or a common BGA pattern.)
SDR735
(Likely a reference to the Snapdragon 730/732G family – SM7150)
SDR675
(Likely a reference to the Snapdragon 675 family – SM6150)
Power Management and Charging Chips (PM/PMI/SMB)
These chips are responsible for managing and regulating the power supply to the main CPU and other components.
Chip Model
Function
PM7250
Power Management IC for the SM7250/765G series.
PM7250B
A variant of the PM7250.
PM6250
Power Management IC.
PM4250
Power Management IC for the SM4250/460 series.
PM6375
Power Management IC for the SM6375/695 series.
PM6350
Power Management IC for the SM6350/690 series.
PM6150L
Power Management IC for the SM6150/675 series.
PM7150A
Power Management IC for the SM7150/730 series.
PMI632
Charging Management IC.
SMB1351
Charging Chip.
SMB1395
Charging Chip.
Modem, RF, and Connectivity Chips (WTR/QPM/VC/WCN/QDM)
These handle cellular communication (Modem/RF) and Wi-Fi/Bluetooth.
Various RF/Front-End Modules (FEM) or Amplifiers (Skyworks/Qorvo/Broadcom components are often given these number designations).
Other Components
Component
Description
BGA254
A standard Ball Grid Array (BGA) package type, often used for memory (eMMC/UFS).
100TB28, RT9759
Less common control or passive ICs.
58255
Unknown specific chip, but likely a small control or logic IC.
Stencil Specifications:
Model: AMAOE U-QSD7
Purpose: Comprehensive reballing stencil for a wide array of Qualcomm Snapdragon 400, 600, and 700-series mobile phone CPUs and supporting ICs.
Thickness:0.12MM
Slogan: “UBGA-植锡专家系列，让植锡更简单！” (UBGA-Tin Planting Expert Series, makes tin planting simpler!)
In short, the U-QSD7 stencil is a repair technician’s tool designed to work on the chips found in a vast majority of modern mid-range Android smartphones.
The provided list is a collection of Qualcomm Snapdragon System-on-Chips (SoCs) and their numerous companion chips (Power Management, RF Transceivers, Front-End Modules, and Connectivity chips).
The CPUs (or main SoCs) on the list are primarily from the Qualcomm Snapdragon 400, 600, and 700 series, which are commonly paired with all the listed companion chips in mid-range to upper-mid-range smartphones.
Here is the list of main CPU/SoC models supported, along with the specific commercial names they represent:
Model Number (SM/SDR)
Commercial Name
Qualcomm Series
Key Characteristics
SM7250
Snapdragon 765 / 765G
Snapdragon 7-series
Mid-range 5G devices (early 5G adoption)
SM7225
Snapdragon 750G 5G
Snapdragon 7-series
Mid-range 5G devices
SM7125
Snapdragon 720G / 730 / 732G
Snapdragon 7-series
Upper mid-range 4G devices
SM6375
Snapdragon 695 5G
Snapdragon 6-series
Mass-market 5G devices
SM6350
Snapdragon 690 5G
Snapdragon 6-series
Entry-level 5G devices
SM6115
Snapdragon 662
Snapdragon 6-series
Mid-range 4G devices
SM4375
Snapdragon 480 / 480+ 5G
Snapdragon 4-series
Entry-level 5G devices
SM4250
Snapdragon 460
Snapdragon 4-series
Entry-level 4G devices
SDR865
Snapdragon 865 Modem/RF
Snapdragon 8-series
This is the Modem component, not the main SoC. The main SoC is SM8250.
SDR735
(Reference to the Modem/RF for Snapdragon 730/732G family)
Snapdragon 7-series
Companion chip for SM7150 / SM7125
SDR675
(Reference to the Modem/RF for Snapdragon 675 family)
Snapdragon 6-series
Companion chip for SM6150
SM42
(Likely an older or internal/incomplete reference, potentially related to the SM4x series.)
Snapdragon 4-series
Companion ICs (Supported by the same stencil)
These chips are almost always required to be reballed/replaced alongside the main CPU and their inclusion on the stencil confirms its comprehensive nature.
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