AMAOE U-QSD6 Stencil SM8150 SDM845 SM7150 (Qualcomm Snapdragon 855/845/730 Collection)

AMAOE U-QSD6 BGA Reballing Stencil (Qualcomm Snapdragon 855/845/730 Collection)

Product Overview

The AMAOE Stencil-U-QSD6 (U-QSD6) is a comprehensive, high-precision BGA (Ball Grid Array) reballing stencil from the patented UBGA – Soldering Expert Series. It is designed for professional technicians to repair the core components of flagship and high-end Android devices spanning the Snapdragon 845, 855, and 730/730G eras, which were dominant in the market from roughly 2018 to 2020.

Key Features and Specifications

• Model: Stencil-U-QSD6 / U-QSD6
• Brand: AMAOE Easy Repair®
• Application: BGA Rework/Reballing for a large collection of Qualcomm Snapdragon CPUs, PMICs, and connectivity chips.

   

• Marketing Focus: Marketed as the “Qualcomm Snapdragon 855/730/845, SM8150/7150/SDM845 Integrated Network.”
• Thickness: 0.12MM—Ensures precise solder ball formation on dense BGA patterns.

   

• Patented Design: ZL2016213989365
• Slogan: Review tools with a deep repair experience / making soldering easier!

Compatible Qualcomm Components (CPU/PMIC/Modem/Memory)

This stencil covers the major components found in top-tier and high-volume mid-range phones of its era:

1. Snapdragon SoCs (CPUs)

• SM8150 (Snapdragon 855 / 855+): Flagship SoC.

   

• SDM845 (Snapdragon 845): Previous generation flagship SoC.
• SM7150 (Snapdragon 730 / 730G): High-performance mid-range SoC.

2. Power Management ICs (PMICs)

These regulate power for the respective CPUs:

• PM8150 / PM8150A / PM8150B (Used with SM8150 / SD 855).
• PM7150 / PM7150A (Used with SM7150 / SD 730).
• PMI8998 / PM845 (Used with SDM845 / SD 845).

   

• PM8005, PMS45 (Auxiliary power/charging management).

3. Modems and Connectivity

• SDR8150, SDRSA (RF Transceiver components for the SD 855 platform).

   

• SDR660 (RF Transceiver, potentially for the SD 845 or 730).
• WCN3990 (High-speed Wi-Fi/Bluetooth chip).

   

4. Memory and General Packages

• RAM556: Pattern for 556-ball BGA RAM packages (common in this era).
• BGA153 / BGA254: Standard package sizes, covering storage (eMMC/UFS) and other small ICs.
• SMB1390: Likely a Quick Charge/Battery Charger IC.

This tool is vital for repairing the sophisticated boards of flagship devices from the Samsung Galaxy S9/S10, Xiaomi Mi 8/Mi 9, OnePlus 6/7 series, and other high-end models of that generation.

The chips listed belong to the core and supporting components for three major Qualcomm Snapdragon mobile platforms: Snapdragon 855 (SM8150), Snapdragon 845 (SDM845), and Snapdragon 730/730G (SM7150).

These platforms powered flagship and high-end Android phones from approximately 2018 to 2020. The auxiliary chips (PMICs, Modems, Audio) are common across the models listed.

Here is a list of mobile models categorized by the main CPU they use:

Primary Snapdragon SoCs (CPUs) and Supported Models

Supporting ICs and their Role in Mobile Devices

The auxiliary chips listed in the stencil are used across various combinations of the above platforms:

The AMAOE U-QSD6 stencil is critical for performing complex, board-level repairs on a wide range of popular, high-value Android flagship devices from the late 2010s to the early 2020s.

Technical Specifications:

• Material: Stainless Steel
• Pattern: Square
• Dimensions (W x H): 10 x 8 cm
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes