AMAOE U-MTU5 BGA Reballing Stencil (Modern MediaTek Dimensity CPU Collection)
AMAOE U-MTU5 BGA Reballing Stencil (Modern MediaTek Dimensity CPU Collection)

AMAOE U-MTU5 BGA Reballing Stencil (Modern MediaTek Dimensity CPU Collection)

AMAOE MTU:5– SUPPORTED ICS, CPU

Dimensity 9400 MT6991Z

Dimensity 9300 MT6989W

Dimensity 9200 MT6985W

Dimensity 6100+ MT6835V

Dimensity 8300 Ultra MT6897Z

Dimensity 7300X MT6878V

Dimensity 7200 Ultra MT6886V

RAM496



₹300.00

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AMAOE U-MTU5 BGA Reballing Stencil (Modern MediaTek Dimensity CPU Collection)
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AMAOE U-MTU5 BGA Reballing Stencil (Modern MediaTek Dimensity CPU Collection)

 

AMAOE U-MTU5 BGA Reballing Stencil (Modern MediaTek Dimensity CPU Collection)

 

 

AMAOE U-MTU5 BGA Reballing Stencil (Modern MediaTek Dimensity CPU Collection)

 

 

Product Overview

 

The AMAOE Stencil-U-MTU5 (U-MTU5) is a state-of-the-art, multi-chip BGA (Ball Grid Array) reballing stencilfrom the patented UBGA – Solder Reinstallation Expert Series. This stencil is specifically developed for professional technicians working on recent and flagship MediaTek Dimensity SoCs (System-on-Chips). It is designed to handle the dense and complex pin layouts of these modern processors, ensuring high-accuracy reballing for complex repair work.

 

Key Features and Specifications

 

  • Model: Stencil-U-MTU5 / U-MTU5
  • Brand: AMAOE Easy Repair®
  • Application: BGA Rework/Reballing for a collection of modern MediaTek Dimensity CPUs and RAM chips.
  • Thickness: 0.12MM—The standard thinness necessary for precise, small-pitch solder ball formation on modern ICs.
  • Material: High-quality steel mesh/stencil.
  • Patented Design: ZL2016213989365
  • Innovation: Features Anti-bulging design with heat dissipation vents—This critical engineering prevents warping and deformation of the stencil when high heat is applied during the reballing process, which is essential for successfully working with large, delicate flagship chips.
  • Slogan: Tools made with the repairman’s experience in mind / making soldering easier!

 

Compatible MediaTek (MTK) Chips and RAM

 

This stencil is a crucial tool for repairing the latest generation of mid-range to flagship MediaTek SoCs:

Chip Model MediaTek Family Name Typical Use
Dimensity 9400 (MT6991Z) Flagship Series High-end/Flagship Smartphones (e.g., Xiaomi, Vivo, OPPO)
Dimensity 9300 (MT6989W) Flagship Series High-end/Flagship Smartphones
Dimensity 9200 (MT6985W) Flagship Series High-end/Flagship Smartphones
Dimensity 8300 Ultra(MT6897Z) High-End Series Performance-focused Mid-to-High-End Smartphones
Dimensity 7300X(MT6878V) Mid-Range Series Mid-Range Smartphones/Foldables
Dimensity 7200 Ultra(MT6886V) Mid-Range Series Mid-Range Smartphones
Dimensity 6100+ (MT6835V) Entry-Level 5G Series Budget 5G Smartphones
RAM496 RAM Package A standard pattern for 496-ball BGA RAM chips common in these devices.

This stencil is an indispensable tool for advanced mobile technicians focused on repairing current-generation, high-value Android flagship and high-end devices.

 

Dimensity CPU Supporting Mobile Models (Examples)

 

Chip Model (Series) MediaTek Family Name Brands and Models (Examples) Typical Release Year
Dimensity 9400(MT6991Z) Flagship Vivo X Series, OPPO Find X Series, Xiaomi Flagship Models (e.g., Xiaomi 15 Series). Expected Late 2024 / 2025
Dimensity 9300(MT6989W) Flagship Vivo X100 Pro, OPPO Find X7, Vivo Pad 3 (some versions). Late 2023 / 2024
Dimensity 9200(MT6985W) Flagship Vivo X90 / X90 Pro, OPPO Find N2 Flip, Redmi K60 Ultra. Late 2022 / 2023
Dimensity 8300 Ultra (MT6897Z) High-End Xiaomi Poco X6 Pro, Xiaomi Redmi K70E. Late 2023 / 2024
Dimensity 7200 Ultra (MT6886V) Mid-Range Xiaomi Redmi Note 13 Pro+ 5G, Vivo V27 Pro. 2023 / 2024
Dimensity 7300X(MT6878V) Mid-Range/Foldable Mid-range smartphones and likely used in flexible/folding devices. Expected 2024
Dimensity 6100+(MT6835V) Budget 5G Samsung Galaxy A15 5G, Realme 11x 5G, Xiaomi Redmi 12 5G. 2023 / 2024
RAM496 RAM Package This is the standard BGA pattern for the 496-ball RAM chips used in conjunction with these modern, large SoC

Technical Specifications:

 

  • Material: Stainless Steel
  • Pattern: Square
  • Dimensions (W x H): 10 x 8 cm
  • Thickness: 0.12mm
  • Color: Silver
  • Item Weight: 50 g
  • Country of Origin: China
  • Net Quantity: 1
  • Reusable: Yes

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of  RS 80  will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

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We Currently Ship Products Only Within India. You Can Place Orders From Across The World But Delivery Addresses Are Restricted To India.

We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com    Or     Call 989533347

Cash On Delivery (Cod) Available

 

Advance Payment Rs 100

COD SHIPPING CHARGE RS150/- ALL INDIA

Thousand Rupees Above Order Full Amount Cod Available

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RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME

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AMAOE U-MTU5 BGA Reballing Stencil (Modern MediaTek Dimensity CPU Collection)
AMAOE U-MTU5 BGA Reballing Stencil (Modern MediaTek Dimensity CPU Collection)

₹300.00

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Need help? Call our award-winning support team 24/7 at +919895333473

Adress

  • Binu Mobiles 
  • No. 6/429-c (12)
     Land Ship Mall,
     Mavoor Road Junction,
     Kozhikode, Pin - 673001 
  • (+91) 9895333473
Mobileicbinu@gmail.com

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Product Subtotal
Qualcomm cpu5 QS11 QiAnLi stencils  × 1 ₹350.00
MI11ULTRA XIAOMI 11ULATRA MIDDLE LAYER STENCIL 11PRO  × 1 ₹300.00
S10 5G G977N G977B MIDDLE LAYER STENCIL  × 1 ₹300.00
S21 MIDDLE LAYER REBALLING STENCIL G991U STENCIL|G991-012 SM-G991U  × 1 ₹350.00
Qualcomm CPU 1 QiAnLi  × 1 ₹350.00
U-QSD4 MSM8953 SDM632 MSM8937 MSM8940 MSM8917 STENCIL  × 1 ₹280.00
U-QSU2 STENCIL Qualcomm CPU  × 1 ₹300.00
MediaTek MTK CPU 4 QS18 QiAnLi  × 1 ₹350.00
AMAOE SAM 15 Stencil SM8350 EXYN2100  × 1 ₹350.00
Subtotal ₹2,930.00
Shipping
Total ₹3,010.00

  • it uses upi apps like bhim, paytm, google pay, phonepe or any banking upi app to make payment.
    if you need any help whatsapp 9895333473
    product delivery all india 3 to 7 days delivery time dtdc courier

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Subtotal:
₹2,930.00
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