AMAOE U-MTU1 BGA Reballing Stencil (MediaTek High-Performance Collection)

Name: AMAOE U-MTU1 BGA Reballing Stencil (MediaTek High-Performance Collection) - mobilestencil
Price: 300.00 INR
Availability: InStock

Product Overview

The AMAOE Stencil-U-MTU1 (U-MTU1) is a high-precision, multi-chip BGA (Ball Grid Array) reballing stencilfrom the patented UBGA-植锡专家系列 (UBGA – Solder Paste Expert Series). This tool is essential for professional technicians, allowing for the precise application of solder paste during the repair of several generations of high-performance and mid-range MediaTek (MTK) CPUs and their corresponding RAM chips.

Key Features and Specifications

Model: Stencil-U-MTU1 / U-MTU1
Application: BGA Rework/Reballing for a consolidated collection of high-end/mid-range MediaTek (MTK) CPUs and RAM chips.
Thickness: 0.12MM—Ensures optimal solder ball size and consistency.
Material: High-quality steel mesh/stencil.
Patented Design: ZL2016213989365
Innovation: Features 散热孔防起鼓设计 (Heat dissipation hole anti-bulging design) to prevent the stencil from warping under heat, guaranteeing accurate pin alignment for successful reballing.
Slogan: 以维修人的体验去做好工具 (Making good tools based on the experience of repair technicians), highlighting its user-focused design.

Compatible MediaTek (MTK) Chips and RAM

This stencil covers popular chips from MediaTek’s Helio X (high-end) and older MT65xx/MT67xx series, including support for the RAM chips that often sit directly on top of or next to the CPU (e.g., POP packages).

Chip Model	MediaTek Family Name	Note on Use
MT6799W	Helio X30 (Deca-core)	High-end/Flagship SoC. Includes stencil pattern for the RAM associated with this chip.
MT6797W	Helio X20 / X25 (Deca-core)	High-end/Mid-range SoC.
MT6795W	Helio X10 (Octa-core)	High-end/Mid-range SoC.
MT6595W	No specific name	Early high-end 4G SoC.
MT6592V	No specific name	Popular mid-range Octa-core 3G SoC.
MT6589V	No specific name	Popular mid-range Quad-core 3G SoC.
MT6582V	No specific name	Entry-level 3G SoC.
RAM256	–	A general pattern for specific RAM packages common on these older chips.

The list of chips (MT6799W, MT6797W, MT6795W, MT6595W, MT6592V, MT6589V, MT6582V) covers MediaTek’s flagship and high-end chips from the 3G era (MT65xx) extending into the early 4G/LTE era (MT67xx, Helio X series), roughly spanning from 2013 to 2017.

These chips were used in prominent phones from major Chinese brands that competed aggressively on performance at the time.

Here is a list of associated mobile models and brands:

Chip Model (Series)	MediaTek Family Name	Brands and Models (Examples)	Era/Performance
MT6799W(RAM included)	Helio X30(Deca-core)	Meizu Pro 7 Plus, Vernee Apollo 2, Elephone P8.	High-End, 4G LTE, ~2017
MT6797W	Helio X20 / X25 (Deca-core)	Xiaomi Redmi Note 4X, Meizu Pro 6 / MX6, LeEco Le 2 / Le 3, HTC One X10, Sony Xperia XA2 Ultra.	High-End/Mid-Range, 4G LTE, ~2016-2017
MT6795W	Helio X10(Octa-core)	Xiaomi Redmi Note 2 / Redmi Note 3, HTC One M9+, MeizuMX5, LeEco Le 1S, Sony Xperia M5.	High-End, 4G LTE, ~2015-2016
MT6595W	No specific name	Meizu MX4, Lenovo Vibe X2.	Early High-End, 4G LTE, ~2014
MT6592V	No specific name	Xiaomi Redmi Note (3G), Huawei Honor 3X, Alcatel OneTouch Idol X+, THL T100S.	Mid-Range, 3G Only, ~2013-2014
MT6589V	No specific name	HTC Desire 600c, ZTE Grand S Flex, Alcatel One Touch Idol, Lava Iris 504Q.	Mid-Range, 3G Only, ~2013
MT6582V	No specific name	Motorola Moto E (1st Gen), Samsung Galaxy Grand Prime (some variants), various budget devices from Lava, Karbonn, Micromax.	Entry-Level, 3G Only, ~2013-2015
RAM256	–	This refers to the standard reballing pattern for common 256-ball BGA RAM chips stacked on top of or next to the CPU in these older devices.	–

Summary

The AMAOE U-MTU1 stencil is designed to address the reballing needs for a significant period of MediaTek’s history, covering everything from the massively popular mid-range 3G Octa-core phones (MT6592) up through the highly-competitive 4G Helio X-series flagships. It is critical for repairing devices that dominated the Asian and emerging markets during the mid-2010s.