AMAOE U-MTK8 Stencil MT 6886 6878 6835 6781 STENCIL

Name: AMAOE U-MTK8 Stencil MT 6886 6878 6835 6781 STENCIL - mobilestencil
Price: 300.00 INR
Availability: InStock

A product description for the AMAOE U-MTK8 Stencil (U-MTK8_钢网) highlights its status as a specialized reballing tool for modern MediaTek Dimensity and related chips, which are prominent in many current Android devices.

Here is a product description, synthesizing the common features of AMAOE stencils and the specific chip support identified for the U-MTK8:

AMAOE U-MTK8 Stencil: Dimensity Series Precision Reballing

Product Headline: MediaTek 5G & Performance CPU Expert

The AMAOE U-MTK8 BGA Reballing Stencil is a professional-grade steel mesh template meticulously engineered for the precision reballing of the latest high-performance and 5G MediaTek (MTK) System-on-Chips (SoCs). Designed for advanced mobile phone repair technicians, this stencil ensures perfect solder ball alignment for complex BGA packages.

Key Supported Chips (CPUs & Companion ICs)

The U-MTK8 stencil is primarily dedicated to the MediaTek Dimensity family and its core companion chips, covering a recent range of 5G and high-performance 4G processors:

Chip Model	Commercial Series (Dimensity)	Function
MT7200 Ultra	Dimensity 7200 Ultra (and related)	High-end 5G Processor (SoC)
MT7300x	Dimensity 7300x (and related)	High-end 5G Processor (SoC)
MT6100+	Dimensity 6100+ (and related)	Mid-range 5G Processor (SoC)
MT6886	Dimensity 1000C series (approx)	High-performance 5G Processor (SoC)
MT6878	Dimensity 820 / Helio G95 (approx)	Performance 5G / 4G Processor (SoC)
MT6835	Dimensity 700 / 720 (approx)	Entry-level 5G Processor (SoC)
MT6781V	Helio G96 / G99 (approx)	High-performance 4G Processor (SoC)
MT6377W, MT6197W	N/A	Power Management (PMIC) / RF Transceiver

Product Features

Model: U-MTK8 (Universal – MTK 8th Generation/Series)
Precision Manufacturing: Made from high-quality stainless steel, offering durability and resistance to thermal expansion.
High Accuracy: Features perfectly aligned apertures (holes) to ensure uniform and precise application of solder paste onto the BGA pads.
Targeted Coverage: Eliminates the need for multiple stencils by consolidating the most frequently repaired chips in the popular MediaTek Dimensity series onto one plate.
Professional Standard: Part of AMAOE’s UBGA (Universal BGA) series, trusted by mobile repair professionals worldwide.

This detailed list provides the precise set of chips and footprints supported by the AMAOE U-MTK8 Stencil. As anticipated, it focuses heavily on modern MediaTek Dimensity processors and their essential companion ICs.

Here is a breakdown of the supported components:

MediaTek Main Processors (CPUs/SoCs)

These are the primary System-on-Chips (SoCs) that the stencil is designed to reball. The accompanying label indicates their commercial association with the Dimensity series.

Chip Model	Commercial MediaTek Series	Function
MT6886V	Dimensity 7200-Ultra / Dimensity 1000 series (approx.)	High-performance 5G SoC.
MT6878V	Dimensity 7300X / Dimensity 800 series (approx.)	High-performance 5G SoC.
MT6835V	Dimensity 6100+ / Dimensity 700 series (approx.)	Mid-range 5G SoC.
MT6781V	Helio G96 / G99 (approx.)	High-performance 4G SoC.

Companion and Power Management ICs (PMIC / RF)

These chips are frequently paired with the above CPUs and handle power, charging, and connectivity.

Chip Model	Function / Category	Notes
MT6377W	Power Management IC (PMIC)	Core power regulator.
MT6368CW	Power Management IC (PMIC)	Core power regulator.
MT6366W	Power Management IC (PMIC)	Core power regulator.
MT6363EW	Power Management IC (PMIC)	Core power regulator.
MT6197W	RF Transceiver	Handles radio frequency signals for cellular/wireless.
MT6186MV	RF Transceiver	Handles radio frequency signals for cellular/wireless.
MT6190MV	RF Transceiver	Handles radio frequency signals for cellular/wireless.
MT6631N	Connectivity Chip	Likely handles Wi-Fi/Bluetooth functions.
77042, 77048E, 77298	RF Front-End Modules (FEM)	Generally Skyworks/Qorvo components used for power amplification and switching.
115749-2R, 58081-11	RF/Switching Components	Other Front-End Module or control components.
VC7916, VC7643	RF/Switching Components	Likely Qorvo/Broadcom or similar vendor components.
41011872	Auxiliary IC	Likely a small logic, driver, or control chip.

Universal BGA Footprints (Memory)

These slots allow the technician to reball standard memory chips that often sit adjacent to the CPU on the main board.

BGA200: Standard BGA package size for memory chips (e.g., eMMC/UFS).
BGA153: Standard BGA package size for memory chips (e.g., eMMC/UFS).
BGA254: Standard BGA package size for memory chips (e.g., eMMC/UFS).

Stencil Summary

Model: AMAOE U-MTK8
Thickness: 0.12MM (Standard for high-precision reballing)
Coverage: “Dimensity 7200-Ultra / 7300X / 6100+ / MT6781V 5G/4G CPU and Auxiliary Chips”
Purpose: To provide comprehensive support for reballing the latest generation of MediaTek Dimensity chips and their core supporting ICs in modern smartphones.

Chip Model	Commercial MediaTek Series Equivalent	Function
MT6886V	Dimensity 7200-Ultra / Dimensity 1000 Series (approx.)	High-end 5G SoC (System-on-Chip)
MT6878V	Dimensity 7300X / Dimensity 800 Series (approx.)	High-end 5G SoC (System-on-Chip)
MT6835V	Dimensity 6100+ / Dimensity 700 Series (approx.)	Mid-range 5G SoC (System-on-Chip)
MT6781V	Helio G96 / G99 Series (approx.)	High-performance 4G SoC (System-on-Chip)

II. Supporting / Companion ICs

These chips are not the main CPU, but are necessary power, modem, and connectivity chips that work with the CPUs listed above and are included on the stencil for convenience and complete repair coverage.

A. Power Management (PMIC)

Chip Model	Function
MT6377W	Power Management IC (PMIC)
MT6368CW	Power Management IC (PMIC)
MT6366W	Power Management IC (PMIC)
MT6363EW	Power Management IC (PMIC)
P1	Likely a reference to a small Power/Control IC

B. RF and Modem Chips

Chip Model	Function
MT6197W	RF Transceiver
MT6186MV	RF Transceiver
MT6190MV	RF Transceiver
MT6631N	Connectivity (Wi-Fi/Bluetooth/GPS)
77042, 77048E, 77298	RF Front-End Modules (FEM/PA)
115749-2R, 58081-11	RF Switch/Control/Front-End components
VC7916, VC7643	RF Switch/Control/Front-End components
41011872	Auxiliary Control Chip

C. Universal Memory BGA Footprints

Footprint	Function
BGA153	Standard footprint for eMMC/UFS memory chips.
BGA200	Standard footprint for eMMC/UFS memory chips.
BGA254	Standard footprint for eMMC/UFS memory chips.

Technical Specifications:

Material: Stainless Steel
Pattern: Square
Dimensions (W x H): 10 x 8 cm
Thickness: 0.12mm
Color: Silver
Item Weight: 50 g
Country of Origin: China
Net Quantity: 1
Reusable: Yes

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of RS 80 will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

Shipping Partner Dtdc Courier

Tracking Link

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We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com Or Call 989533347

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Advance Payment Rs 100

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AMAOE U-MTK8 Stencil MT 6886 6878 6835 6781 STENCIL