AMAOE U-MTK3 Stencil: Budget & Older Mid-Range MediaTek CPU Expert

AMAOE U-MTK3 Stencil: Budget & Older Mid-Range MediaTek CPU Expert

Product Overview

The AMAOE U-MTK3 Stencil (U-MTK3_钢网) is specifically engineered for precise BGA reballing of several widely used MediaTek CPUs and their supporting ICs, particularly those belonging to the older Helio P-series, A-series, and the budget-focused MT65xx series. It ensures professional-grade reballing for common repair scenarios in these devices.

Key Supported Chips (CPUs & SoCs)

The stencil covers a critical selection of older MediaTek Application Processors:

Supported Companion and Memory Footprints

The stencil also provides dedicated slots for the following companion chips:

General Specifications

• Model: AMAOE U-MTK3 (Sometimes listed as MU:3)

   

• Function: BGA Reballing Stencil
• Thickness: 0.12MM (Standard for precision reballing)
• Material: High-quality, durable stainless steel.
• Usage: Used with solder paste or solder balls to perfectly align the BGA connections on the chips listed above during the repair process.

AMAOE U-MTK3 Stencil: Budget & Older Mid-Range MediaTek CPU Expert

Product Overview

The AMAOE U-MTK3 Stencil (U-MTK3_钢网) is a high-precision, stainless steel reballing stencil specifically designed for micro-soldering repairs on popular MediaTek Helio P-series, A-series, and budget-focused 4G chipsets. This stencil provides technicians with the precise patterns needed to reball both the Application Processors (CPUs) and their essential power management and RF support chips.

• Model: AMAOE U-MTK3
• Thickness: 0.12MM (Standard professional-grade thinness for precise solder paste application).
• Material: High-quality Stainless Steel, ensuring durability and heat resistance.
• Patent: ZL2016213989365 (Indicates a patented product design).

Key Supported Processors (CPUs/SoCs)

The stencil is primarily marketed for the following highly common processors found in budget and mid-range devices:

Supported Companion ICs and Footprints

The stencil is made versatile by including patterns for the critical supporting chips that are often repaired alongside the main CPU:

Power Management ICs (PMICs)

RF and Connectivity Chips

Universal Memory Footprints

Summary of Use

The AMAOE U-MTK3 is a foundational tool for any mobile repair shop dealing with older Android devices, providing precise alignment for the core components responsible for power, cellular function, and main processing in a large segment of the budget smartphone market.

Technical Specifications:

• Material: Stainless Steel
• Pattern: Square
• Dimensions (W x H): 10 x 8 cm
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes