AMAOE U-MIXU2 8-in-1 Hybrid CPU & RAM BGA Reballing Stencil (0.12mm) – MT6899 / HI6290 / HI36A0 / A18 / A15, Dimensity 8400

Supported ICs & Slot Layout

Slot # Label on Stencil Chipset / Component Details
1 麒麟Kirin9020-Hi36C0 Huawei HiSilicon Kirin 9020 CPU (Hi36C0)
2 SE3-A15 Apple iPhone SE (3rd Gen) A15 Bionic CPU
3 A18 Apple A18 Bionic CPU
4 A18 Pro (printed as A18 Rro) Apple A18 Pro Bionic CPU
5 天玑8400-MT6899Z MediaTek Dimensity 8400 CPU (MT6899Z)
6 RAM496 496-Ball Mobile LPDDR RAM Package
7 麒麟Kirin8000-Hi6290 V110 Huawei HiSilicon Kirin 8000 CPU (Hi6290 V110)
8 麒麟Kirin9000S-Hi36A0-V120 Huawei HiSilicon Kirin 9000S CPU (Hi36A0 V120)

Technical Specifications

  • Brand: AMAOE (阿毛易修)
  • Series: UBGA Reballing Expert Series (UBGA-植锡专家系列)
  • Model: U-MIXU2
  • Type: Hybrid CPU Collection Stencil (混合-CPU 集合网)
  • Thickness: 0.12mm
  • Patent Number: ZL2016213989365
  • Barcode / SKU Reference: 41011879

₹300.00

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  •  Title: AMAOE U-MIXU2 8-in-1 Hybrid CPU & RAM BGA Reballing Stencil (0.12mm) – Kirin 9020 /HI36C0/9000S / 8000, Apple A18 / A18 Rro / SE3-A15, Dimensity 8400 MT6899Z RAM496 HI6290 HI36A0
  •  AMAOE U-MIXU2 Multi-Brand CPU BGA Stencil (0.12mmAMAOE U-MIXU2 8-in-1 Hybrid CPU & RAM BGA Reballing Stencil (0.12mm) – MT6899 / HI6290 / HI36A0 / A18 / A15, Dimensity 8400

AMAOE U-MIXU2 8-in-1 Hybrid CPU & RAM BGA Reballing Stencil (0.12mm) – MT6899 / HI6290 / HI36A0 / A18 / A15, Dimensity 8400

Product Title Options

  • Standard E-Commerce Title: AMAOE U-MIXU2 8-in-1 Hybrid CPU & RAM BGA Reballing Stencil (0.12mm) – Kirin 9020 / 9000S / 8000, Apple A18 / A18 Pro / SE3-A15, Dimensity 8400
  • Short Title: AMAOE U-MIXU2 Multi-Brand CPU BGA Stencil (0.12mm)

Product Overview

The AMAOE U-MIXU2 is a professional-grade, 0.12mm BGA reballing stencil engineered for precision motherboard repair across Huawei (Kirin), Apple (A-Series), and MediaTek (Dimensity) flagship processors. Part of AMAOE’s UBGA Expert Series, this 8-in-1 hybrid stencil features an advanced heat-dissipation perforation layout designed to prevent warping and bulging under high hot-air temperatures, ensuring uniform solder ball formation on the first pass.

Key Features

  • 8-in-1 Multi-Brand Compatibility: Combines popular Huawei Kirin, Apple iPhone, and MediaTek Dimensity CPU and RAM patterns onto a single work plate.
  • Anti-Drum / Anti-Bulge Thermal Design: Integrated surrounding vent holes equalize thermal expansion during heating, preventing the stencil from arching or lifting off the IC.
  • Optimal 0.12mm Thickness: Balances structural rigidity with precise solder paste volume for fine-pitch mobile SoC pads.
  • Laser-Cut Precision: Clean, burr-free square and round apertures allow smooth stencil release without dragging or bridging solder balls.

Supported ICs & Slot Layout

Slot # Label on Stencil Chipset / Component Details
1 麒麟Kirin9020-Hi36C0 Huawei HiSilicon Kirin 9020 CPU (Hi36C0)
2 SE3-A15 Apple iPhone SE (3rd Gen) A15 Bionic CPU
3 A18 Apple A18 Bionic CPU
4 A18 Pro (printed as A18 Rro) Apple A18 Pro Bionic CPU
5 天玑8400-MT6899Z MediaTek Dimensity 8400 CPU (MT6899Z)
6 RAM496 496-Ball Mobile LPDDR RAM Package
7 麒麟Kirin8000-Hi6290 V110 Huawei HiSilicon Kirin 8000 CPU (Hi6290 V110)
8 麒麟Kirin9000S-Hi36A0-V120 Huawei HiSilicon Kirin 9000S CPU (Hi36A0 V120)

Technical Specifications

  • Brand: AMAOE (阿毛易修)
  • Series: UBGA Reballing Expert Series (UBGA-植锡专家系列)
  • Model: U-MIXU2
  • Type: Hybrid CPU Collection Stencil (混合-CPU 集合网)
  • Thickness: 0.12mm
  • Patent Number: ZL2016213989365
  • Barcode / SKU Reference: 41011879

SEO Tags & Keywords

AMAOE U-MIXU2, U-MIXU2 Stencil, Kirin 9020 Stencil, Hi36C0 BGA Stencil, Kirin 9000S Hi36A0 V120, Kirin 8000 Hi6290 V110, Dimensity 8400 MT6899Z Stencil, iPhone 16 A18 Pro BGA Stencil, iPhone SE3 A15 Stencil, RAM496 Stencil, 0.12mm CPU Reballing Stencil, 41011879

 

U-MIXU2_Stencil
2025-03-12 A-Mao Repair
Kirin 9020 - Hi36C0 (SE3-A15, A18, A18 Pro)
Dimensity 8400 - MT6899Z (RAM496); Kirin 8000 - Hi6290 (V110); Kirin 9000S - Hi36A0 (V120)

 

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of  RS 80  will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

Shipping Partner Dtdc Courier

Tracking Link

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We Currently Ship Products Only Within India. You Can Place Orders From Across The World But Delivery Addresses Are Restricted To India.

We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com    Or     Call 9895333473

Cash On Delivery (Cod) Available

 

Advance Payment Rs 100

COD SHIPPING CHARGE RS150/- ALL INDIA

Thousand Rupees Above Order Full Amount Cod Available

Cash On Delivery Availability, Check Your City PinCod  

LINK

Location Finder

RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME

Tracking Link

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AMAOE U-MIXU2 8-in-1 Hybrid CPU & RAM BGA Reballing Stencil (0.12mm) – MT6899 / HI6290 / HI36A0 / A18 / A15, Dimensity 8400
AMAOE U-MIXU2 8-in-1 Hybrid CPU & RAM BGA Reballing Stencil (0.12mm) – MT6899 / HI6290 / HI36A0 / A18 / A15, Dimensity 8400

₹300.00

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India

India

Product Subtotal
Qualcomm CPU 1 QiAnLi  × 1 ₹350.00
Subtotal ₹350.00
Shipping
Total ₹430.00
  • it uses upi apps like bhim, paytm, google pay, phonepe or any banking upi app to make payment.
    if you need any help whatsapp 9895333473
    product delivery all india 3 to 7 days delivery time dtdc courier

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AMAOE U-MIXU2 8-in-1 Hybrid CPU & RAM BGA Reballing Stencil (0.12mm) – MT6899 / HI6290 / HI36A0 / A18 / A15, Dimensity 8400
AMAOE U-MIXU2 8-in-1 Hybrid CPU & RAM BGA Reballing Stencil (0.12mm) – MT6899 / HI6290 / HI36A0 / A18 / A15, Dimensity 8400
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₹300.00
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