HIU3 BGA Reballing Stencil for Huawei CPUs HI3690HI3670 HI9500 HI3680

AMAOE U-HIU3 BGA Reballing Stencil

The AMAOE U-HIU3 is a professional reballing stencil from the “UBGA – Tinning Expert Series”, expertly crafted to make the challenging process of IC reballing easier and more precise. This single tool is a comprehensive solution for technicians, providing patterns for multiple generations of Huawei’s flagship processors.

Key Features & Benefits

• Universal Flagship Kirin Compatibility: This stencil is an all-in-one solution for a wide range of Huawei devices. It features precision patterns for the Kirin 9000, both the Kirin 990 5G and 4G variants, as well as the Kirin 980 and Kirin 970 CPUs. It also supports their corresponding RAM chips, including RAM 376, HI9500 V1, and HI36A0 RAM.

   

• Next-Level Precision: With an ultra-thin 0.10mm thickness, this stencil offers superior accuracy compared to standard 0.12mm stencils. This allows for flawless solder paste application on the most delicate and high-density pads of the latest mobile CPUs, significantly reducing the risk of solder bridges and ensuring a perfect reflow.
• Anti-Bulging Heat Dissipation Design: This patented feature is crucial for consistent reballing. The specially designed vents prevent the solder paste from bulging or deforming during the heating process. This ensures every solder ball is perfectly spherical and uniform, leading to a stronger, more reliable connection once the chip is reinstalled.
• Durable & Trustworthy: This stencil is a Patented Product, manufactured with the repairman’s experience in mind. Its high-quality construction ensures durability and long-term reliability, making it an essential and lasting investment for any professional toolkit.

Technical Breakdown

• Model: U-HIU3
• Series: UBGA – Tinning Expert Series
• Thickness: 0.10MM
• Material: High-quality, durable metal
• Supported CPUs:
  • Kirin 9000 (HI36A0)

     

  • Kirin 990 (HI3690 5G, HI3690 4G)

     

  • Kirin 980 (HI3680)

     

  • Kirin 970 (HI3670)

     

• Application: Ideal for addressing common faults like a device that won’t power on, gets stuck in a boot loop, or has connectivity issues caused by a detached or compromised CPU.

1. Kirin 990 (Hi3690) – 5G and 4G Versions

• Kirin 990 5G (Hi3690):

  • Process: Manufactured using TSMC’s 7 nm+ EUV process.

  • CPU: Octa-core configuration with 2x Cortex-A76 @2.86 GHz, 2x Cortex-A76 @2.36 GHz, and 4x Cortex-A55 @1.95 GHz.

  • GPU: 16-core Mali-G76.

  • AI: Dual-core NPU based on HUAWEI Da Vinci Architecture (Ascend Lite + Ascend Tiny).

  • Modem: Integrated 5G modem supporting SA/NSA networks, 2G/3G/4G/5G multi-mode, and peak downlink rates.

  • ISP: Kirin ISP 5.0 with BM3D noise reduction for DSLR-level image processing.

  • Memory: Supports LPDDR4X.

• Kirin 990 4G (Hi3690):

  • Similar to the 5G version but lacks integrated 5G modem. Also manufactured using TSMC’s 7 nm FinFET process.

🔍 2. Kirin 970 (Hi3670)

• Process: Not explicitly mentioned in search results, but historically built on 10 nm process.

• Analysis: TechInsights provides a digital functional analysis of this chip, focusing on its floorplan and block utilization.

• Use Case: Found in Huawei devices like the Mate 30 Pro 4G.

🔍 3. Kirin 9000s (Hi36A0)

• Process: Manufactured by SMIC using 7 nm N+2 FinFET process (a significant achievement for China’s semiconductor industry).

• Usage: Powers Huawei Mate 60 Pro 5G smartphones (launched in 2023).

• Markings: Labeled as Hi36A0 GFCV120, similar to earlier Kirin 9000 series chips.

🔍 4. Kirin 980 (Hi3680)

• While not detailed in the search results, it is mentioned in an eBay listing as a repurposed IC die sold as decorative tech art.

🔍 5. RAM 376

• This likely refers to RAM-376-TAL3, a mounting hardware component (e.g., ball adaptor and quick-release base) for marine/RV/kayak installations, unrelated to Kirin chips.

🔍 6. H19500 V1

• Not explicitly covered in the search results. It may refer to a specific variant or component related to Kirin chips, but further context is needed.

🔍 7. Hi36A0 RAM

• The Kirin 9000s (Hi36A0) likely uses LPDDR5 or similar memory, though specifics are not provided in the search results. Earlier Kirin chips (e.g., 990) use LPDDR4X.

📊 Summary Table

Technical Specifications:

• Material: Stainless Steel
• Pattern: Square
• Dimensions (W x H): 10 x 8 cm
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes