AMAOE SU1 Universal Reballing Stencil for Spreadtrum/Unisoc CPUs

AMAOE SU1 Universal Reballing Stencil for Spreadtrum/Unisoc CPUs

This is a professional, universal reballing stencil from AMAOE, designed for a wide range of devices powered by Spreadtrum (now known as Unisoc) processors. The SU1 is an essential tool for technicians working on affordable smartphones and feature phones.

Key Features

• Universal Compatibility: This stencil offers patterns for a comprehensive list of common Spreadtrum/Unisoc CPUs, allowing a single tool to handle multiple repairs on various devices. The compatible chips include:
  • SC7727S, SC7730S, SC7731G, SC7715A, SC7730A
  • SC9832A, SC9830A
  • SC8830A, SC8825C, SC8825A
  • SC6825A
• Anti-Bulging Heat Dissipation Vents: The stencil features specialized vents that prevent it from deforming or lifting when heated. This guarantees the stencil remains perfectly flat against the chip, which is critical for precise solder paste application and preventing shorts.
• Optimal 0.12mm Thickness: With a precision thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to each pad.
• Patented Design: The stencil’s core features are protected by a Chinese patent, reinforcing its status as a professionally-developed tool.

SC7727S

A dual-core chip for basic 3G smartphones.

• Alcatel One Touch Pop D3
• i-mate Juno
• Huawei Y360

SC7730A / SC7730S

These are quad-core chips used in a variety of budget-friendly 3G Android smartphones.

• Samsung: Galaxy J1 Ace (J111M), Galaxy J1 Mini (J105H)
• Wiko: Wiko Sunny, Wiko Kenny
• QMobile: QMobile M95, M80

SC7731G

A widely used quad-core chip for entry-level 3G smartphones.

• Samsung: Galaxy J1 Ace (J110F), Galaxy J2 (J200F)
• Lenovo: Lenovo A2010, Vibe C2
• Alcatel: Alcatel Pixi 4 (5), Pixi 4 Plus Power

SC7715A

An entry-level single-core processor for 3G smartphones.

• Motorola: Moto E (XT1021)
• Micromax: Micromax Bolt A067, Canvas 2 Plus A110
• Fly: Fly IQ4404
• ZTE: ZTE Blade G V880G

SC9832A

A quad-core processor for budget-friendly 4G smartphones.

• Motorola: Moto C Plus, Moto E4
• Lava: Lava Z60, Z90
• Karbonn: Karbonn Aura Note 4G
• Lenovo: Lenovo A Plus

SC9830A

A quad-core chip for low-cost 4G smartphones.

• Samsung: Galaxy J3 (2016), Galaxy J2 (2016), Galaxy J1 Mini Prime (J106B)
• Alcatel: Alcatel Pixi 4 (6)
• LG: LG K4 LTE (K120AR)

SC8830A

A quad-core processor for budget-friendly 3G/4G smartphones.

• Samsung: Galaxy Grand Prime Value Edition (SM-G531), Galaxy J1 Ace (J111M)
• Micromax: Canvas Spark 2 Plus
• iBall: iBall Andi F2F 5.5D

SC8825A

A dual-core chip used in early Android phones with 3G support.

• Prestigio: Prestigio MultiPhone 3400 Duo
• MyPhone: MyPhone A888 Duo
• Karbonn: Karbonn A1+

SC8825C

A variant of the SC8825, also used in entry-level Android devices.

• ZTE: ZTE V765M
• Amoi: Amoi V35
• G’Five: G’Five G-867

SC6825A

A dual-core processor for entry-level Android smartphones.

• Lenovo: Lenovo A390, A680
• Alcatel: Alcatel One Touch Pixi 2
• Tecno: Tecno P3
• Itel: Itel it1508

Technical Specifications:

• Material: Stainless Steel
• Pattern: Square
• Dimensions (W x H): 10 x 8 cm
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes