The AMAOE Stencil U-SMU1 is a specialized, high-precision BGA reballing stencil from AMAOE (阿毛易修®), designed specifically for professional repair technicians working with a range of Samsung Exynos CPUs and their accompanying RAM chips. As part of the “UBGA – Tin Planting Expert Series,” this stencil aims to simplify complex reballing tasks for critical Samsung components.
Key Product Features:
Ultra-Precision 0.12mm Thickness: Engineered to match the delicate BGA pad pitch of Samsung Exynos processors and their stacked RAM. This precise thickness ensures uniform solder paste application and flawless solder ball formation, crucial for preventing short circuits and ensuring reliable connections.
Comprehensive Exynos CPU & RAM Support: The “Samsung Exynos CPU Collection Network” (三星 Exynos CPU集合网) designation means this stencil supports a wide and practical array of popular Exynos chipsets and their RAM modules.
Supported Exynos CPUs Include:
Exynos 8895 (High-end flagship)
Exynos 7880 (Mid-range)
Exynos 7870 (Mid-range)
Exynos 7580 (Mid-range)
Exynos 7570 (Entry-level)
Exynos 3475 (Entry-level)
Exynos 3470 (Entry-level)
Dedicated RAM Stencil: Includes specific patterns for Exynos 8895 RAM, vital for reballing the memory chip that is often stacked directly on the CPU.
Patented Anti-Bulging Design: Features specialized heat dissipation holes with an “anti-bulging design” (散热孔防起鼓设计). This innovative engineering prevents the stencil from deforming or lifting during the heating process, ensuring consistent contact and perfect reballing results every time.
High-Quality Construction: Manufactured from durable steel (implied by “钢网,” steel mesh, and AMAOE’s known quality), ensuring exceptional longevity and resistance to warping under the high temperatures required for BGA rework.
AMAOE’s Technician-Centric Philosophy: Developed “from the experience of repair technicians” (以维修人的体验去做好工具), reflecting AMAOE’s commitment to creating practical and effective tools that simplify repairs.
Patented Product: Confirmed by “专利产品” and patent number ZL2016213989365.
Why Choose the AMAOE U-SMU1 Stencil?
The AMAOE U-SMU1 stencil is an indispensable tool for chip-level repair, empowering technicians to efficiently and accurately rework complex Samsung Exynos processors and their integrated RAM. By streamlining the reballing process for these critical components, it helps restore functionality to devices suffering from CPU/RAM-related issues, making “tin planting simpler!”
Exynos 8895 Series
Exynos 8895 and Exynos 8895-1703: The Exynos 8895 is an octa-core, high-end processor (often found in 2017-2018 flagship models). The designation Exynos 8895-1703 appears to be a specific internal production or variant code and does not denote a significant difference in core specifications from the standard Exynos 8895.
Architecture: Octa-core (4x Samsung Custom Mongoose M2 @ up to 2.3 GHz + 4x Cortex-A53 @ 1.7 GHz)
Process: 10nm FinFET
Exynos 8895 RAM: Supports LPDDR4X memory. Actual device implementations varied, with models like the Samsung Galaxy S8/S8+ having 4 GB RAM, and the Galaxy Note 8 having 6 GB RAM.
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