Name: AMAOE Stencil Qualcomm WCD/WCN WC1 - Audio & Connectivity IC Reballing Net (0.12mm) - mobilestencil
Price: 300.00 INR
Availability: InStock

AMAOE Stencil Qualcomm WCD/WCN WC1 – Audio & Connectivity IC Reballing Net (0.12mm)

AMAOE Stencil Qualcomm WCD/WCN WC1 - Audio & Connectivity IC Reballing Net (0.12mm)

AMAOE Stencil Qualcomm WCD/WCN WC1 – Audio & Connectivity IC Reballing Net (0.12mm)

The AMAOE Stencil Qualcomm WCD/WCN WC1 is a high-precision, professional BGA reballing stencil from AMAOE (阿毛易修®). It is meticulously designed for technicians to accurately rework and reball various crucial Qualcomm ICs responsible for Audio (WCD series) and Wireless Connectivity (WCN series – Wi-Fi, Bluetooth, FM) in mobile devices. Crafted “with the experience of repair professionals in mind,” this stencil ensures reliability and precision in intricate component-level repairs.

Key Product Features:

Precision 0.12mm Thickness: Optimized for the fine-pitch BGA pads of Qualcomm’s WCD and WCN series ICs, ensuring perfect solder paste application and flawless solder ball formation.
Comprehensive Audio & Connectivity Support: This “Qualcomm WCD Audio/WCN WiFi Comprehensive” stencil (高通-WCD音频/WCN WiFi) is a versatile tool, supporting a broad range of popular Qualcomm Audio Codec and Wireless Connectivity ICs.
- Supported WCD Audio Codecs Include:
  - WCD9330
  - WCD9341/WCD9340
  - WCD9335/WCD9326
  - WCD9304
  - WCD9302/WCD9306
  - WCD9310
  - WCD9320
- Supported WCN Wi-Fi/Bluetooth ICs Include:
  - WCN3680/WCN3660
  - WCN3620
  - WCN3980
  - WCN3990
  - WCN3615/WCN3610
Durable Construction: Made from high-quality steel, guaranteeing exceptional durability, resistance to warping under high temperatures, and an extended lifespan essential for professional rework.
AMAOE Quality Assurance: Part of AMAOE’s trusted line of repair tools, developed to meet the rigorous demands of micro-soldering and chip-level repair.

Why Choose the AMAOE WC1 Stencil?

Faulty audio or wireless connectivity can render a device largely unusable. The AMAOE WC1 stencil provides the precision and broad compatibility needed to effectively reball these vital Qualcomm WCD (Audio) and WCN (Wi-Fi/Bluetooth) ICs. Technicians can confidently repair issues such as no audio, distorted sound, Wi-Fi/Bluetooth not connecting, or intermittent wireless performance, restoring full functionality to the device. This stencil is an indispensable asset for comprehensive smartphone repair.

The listed components, such as the WCN and WCD series, are primarily Qualcomm (or Qualcomm Atheros) Integrated Circuits (ICs) used in mobile and embedded devices.

The parts can be grouped into two main categories:

1. WCN Series (Wireless Connectivity) 📶

These are generally Wi-Fi, Bluetooth, and often FM radio combo chips that provide wireless connectivity. They are commonly seen in smartphones and other wireless devices.

WCN3680/WCN3660: Bluetooth 4.0 (BR/EDR+BLE) and often Wi-Fi (WCN3680 is noted to support 802.11ac, BT 4.0, and FM).
WCN3620: Bluetooth 4.0 (BR/EDR+BLE) component.
WCN3980: WLAN (Wi-Fi), Bluetooth (BT 5.0/5.1), and FM combo solution, supporting 802.11ac.
WCN3990: WLAN (Wi-Fi) and Bluetooth (BT 4.2/5.0/5.1) combo solution, supporting 802.11ac and often 2×2 MIMO.
WCN3615/WCN3610: Wireless Connectivity triple combo device (single band 802.11n WLAN, BT, FM).

2. WCD Series (Audio Codecs) 🎧

These are Audio Codecs (Coder-Decoder) that handle the analog-to-digital and digital-to-analog conversion for audio signals, managing microphone inputs, speaker outputs, and digital audio paths. The “WCD” likely stands for Wireless Codec Device or a similar term for audio-related chips.