AMAOE Stencil EMMC/EMCP/UFS EMMC2

EMMC/EMCP Model Supporting List by BGA Package Type

BGA153 (11.5mm x 13mm or 10mm x 11.5mm standard dimensions)

• Description: This is one of the most common EMMC/EMCP packages, often seen in older to mid-range smartphones and tablets. It’s identified by having 153 solder balls.
• Common Use: Widely used for standard EMMC chips, particularly in Android phones and tablets from various manufacturers (Samsung, Xiaomi, Huawei, Oppo, Vivo, etc.) that required efficient and compact storage.
• Example EMMC Manufacturers/Series (any that use this package): Samsung KMxxxx, SanDisk SDINxxxx, SK Hynix H9TPxxxx, Micron MTFCxxxx.

BGA162 (11.5mm x 13mm standard dimensions)

• Description: Similar to BGA153 in physical size but with a slightly different ball arrangement, having 162 solder balls. Also very common.
• Common Use: Found in many smartphones and tablets, serving as the main storage solution. Often interchangeable with BGA153 in terms of device application, depending on the specific EMMC model a manufacturer chooses.
• Example EMMC Manufacturers/Series: Samsung KMxxxx, SanDisk SDINxxxx, SK Hynix H9TPxxxx, Micron MTFCxxxx.

BGA169 (11.5mm x 13mm or 10mm x 11.5mm standard dimensions)

• Description: A slightly higher pin count than 153/162, but with similar dimensions. Very prevalent in smartphones.
• Common Use: One of the most ubiquitous EMMC packages, found across a vast range of Android smartphones and tablets from virtually all manufacturers (Samsung, Huawei, Xiaomi, Oppo, Vivo, etc.).
• Example EMMC Manufacturers/Series: Samsung KMxxxx, SanDisk SDINxxxx, SK Hynix H9TPxxxx, Micron MTFCxxxx.

BGA186 (12mm x 16mm standard dimensions)

• Description: This package is typically larger than 153/162/169 and often indicates a higher capacity EMMC or EMCP chip, or a chip with more integrated components (in the case of EMCP).
• Common Use: Found in smartphones, tablets, and sometimes in embedded systems that require more storage and/or slightly more complex control lines.
• Example EMMC Manufacturers/Series: Samsung KMxxxx, SanDisk SDINxxxx, SK Hynix H9TPxxxx, Micron MTFCxxxx.

BGA221 (11.5mm x 13mm or 10mm x 11.5mm standard dimensions)

• Description: Despite having a high ball count (221), this package can sometimes maintain a compact footprint, allowing for denser connections. It’s often associated with EMCP or more advanced EMMC modules.
• Common Use: Increasingly found in mid-range to higher-end smartphones and tablets, especially for EMCP (where RAM and EMMC are in one package) due to the need for more I/O pins.
• Example EMMC Manufacturers/Series: Samsung KMxxxx, SanDisk SDINxxxx, SK Hynix H9TPxxxx, Micron MTFCxxxx.

BGA254 (12mm x 16mm or 11.5mm x 13mm standard dimensions)

• Description: This is one of the highest pin count packages for EMMC/EMCP, often used for very high-capacity modules or EMCP chips that integrate significant RAM alongside the flash memory.
• Common Use: Predominantly found in high-end smartphones and tablets, particularly those utilizing EMCP for compact designs and efficient data transfer between RAM and storage.
• Example EMMC Manufacturers/Series: Samsung KMxxxx, SanDisk SDINxxxx, SK Hynix H9TPxxxx, Micron MTFCxxxx

Technical Specifications:

• Material: Stainless Steel
• Pattern: Square
• Dimensions (W x H): 10 x 8 cm
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes