The AMAOE BCM:1 Stencil is a BGA (Ball Grid Array) reballing stencil designed for repairing and re-soldering various Broadcom BCM series Wi-Fi/Bluetooth Combo ICs commonly found in mobile phones.
The stencil is a universal tool that covers a list of popular Broadcom chips and includes a generic slot for chips with a specific BGA pattern.
⚙️ Stencil Details and Supported ICs
The AMAOE BCM:1 stencil is a single 0.12MM thickness stencil that features multiple pre-cut BGA patterns for the chips listed below.
Common Wi-Fi/Bluetooth combo chips (e.g., 802.11n). Note that 43340/43341 appear twice in the list.
4339
Popular Wi-Fi/Bluetooth combo chip (e.g., 802.11ac, a/b/g/n) found in many flagship devices.
4343
Wi-Fi/Bluetooth combo chip (e.g., 802.11n).
43438
A version of a Wi-Fi/Bluetooth chip.
43455
Wi-Fi/Bluetooth combo chip.
4354, 4356
Wi-Fi/Bluetooth combo chips (e.g., BCM4356 is an 802.11ac, BT 4.1 chip).
43596
Wi-Fi/Bluetooth combo chip.
43340/43311
This appears to be a combined slot for BCM43340 and BCM43311 (a similar Wi-Fi/BT chip).
GPS/Sensors
4774, 4773
While most of the BCM4xxx series are Wi-Fi/BT, BCM477x chips are often GNSS/GPS sensor hub ICs, indicating the stencil may support other common BGA chips besides just Wi-Fi.
Universal Slot
0.4X18X18
A generic 18mm x 18mm area with a 0.4mm pitch BGA grid, allowing for the reballing of other chips that share this common ball layout.
Total Slots: The stencil provides 11 common BCM Wi-Fi chip slots plus one universal slot.
Purpose: The stencil is used to align and apply solder paste/balls precisely to the BGA pads of the chips before re-soldering them onto the motherboard.
AMAOE BCM:1 Stencil Supported IC List
The stencil is designed to reball chips with a 0.12MM thickness and covers the following Broadcom ICs:
Broadcom IC Part Number (BCM)
Function/Standard
Common Applications/Devices (General)
4330
Wi-Fi (802.11n/g/b) & Bluetooth Combo
Older flagship smartphones and tablets (e.g., Samsung Galaxy S3, Google Nexus 7, various HTC models).
4334, 43340, 43341
Wi-Fi (802.11n) & Bluetooth Combo
Mid-range to high-end smartphones and tablets of the 2012-2014 era.
4339
Wi-Fi (802.11ac) & Bluetooth Combo
High-end smartphones and tablets (e.g., Samsung Galaxy S5, various LG models, sometimes referred to as “5G WiFi” in older marketing).
4343
Wi-Fi (802.11n) & Bluetooth Combo
Often used in IoT devices and single-board computers (e.g., early Raspberry Pi models).
43438
Wi-Fi (802.11n) & Bluetooth 4.1 Combo
Low-cost smartphones, wearables, and other portable devices.
43455
Wi-Fi (802.11ac) & Bluetooth Combo
Newer IoT devices and single-board computers (e.g., Raspberry Pi 3B+/4B, Compute Module 4).
4354, 4355, 4356
Wi-Fi (802.11ac) & Bluetooth Combo
Premium smartphones, tablets, and mobile devices of the mid-2010s. BCM4356 is also a known Wi-Fi/BT chip in the Nintendo Switch.
43596
Wi-Fi (802.11ac) & Bluetooth Combo
High-performance mobile and connectivity devices.
4773, 4774
GNSS/Location Hub IC (GPS/GLONASS/Galileo)
Smartphones, tablets, and wearables. The BCM477x series are often Location Hubs that integrate a GNSS receiver and a Sensor Hub to offload tasks from the main application processor.
43340/43311
Combo Slot
Shared pattern for BCM43340 and BCM43311 (similar generation Wi-Fi/BT chips).
13138
(BCM13138)
This is an unusual number for a Broadcom IC. It is either a specific non-wireless chip or a typo for another common BCM part (like BCM5976 touch controller, or a different series chip). Given the context, it’s a chip that shares a BGA footprint with one of the slots.
Universal Slot
0.4X18X18 IC: This is a universal slot on the stencil.
Size: 18mm x 18mm area.
Pitch:0.4mm pitch (the distance between the centers of adjacent solder balls).
Function: It allows a technician to reball any BGA chip (not just Broadcom) that has an 18x18mm footprint with a 0.4mm pitch. This significantly extends the usability of the stencil beyond the listed ICs.
Technical Specifications:
Material: Stainless Steel
Pattern: Square
Dimensions (W x H): 10 x 8 cm
Thickness: 0.12mm
Color: Silver
Item Weight: 50 g
Country of Origin: China
Net Quantity: 1
Reusable: Yes
shipping & delivery
Shipping & Delivery information :
Shipping Charges: A shipping fee of RS 80 will be applied to orders
Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.
There are no reviews yet.