AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series

AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series

Product Title AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series

Short Description (For WooCommerce Product Summary) Original AMAOE SAM:22 Superhard 0.12mm BGA Reballing Stencil. Specifically engineered for Samsung A17 and compatible smartphones featuring MediaTek MT6789V, MT6769V, and Qualcomm SM6475 CPUs, along with BGA254 memory, RF transceivers, and power management ICs.

Full Product Description

Upgrade your micro-soldering precision with the AMAOE SAM:22 Superhard Series BGA Reballing Stencil. Crafted from high-grade 0.12mm imported Japanese stainless steel, this stencil is designed with anti-drum (anti-bulging) reinforcement holes around the primary CPU cutouts to prevent warping under high hot-air rework temperatures. It provides accurate hole alignment for seamless solder paste application and uniform solder ball formation.

Supported ICs & Cutouts on Stencil:

• Main CPUs (Processors):

• MT6789V (MediaTek Helio G99)

• SM6475 (Qualcomm Snapdragon 6 Gen 3)

• MT6769V (MediaTek Helio G85 / G80)

• Memory / Storage:

• BGA254 (UFS / eMCP Memory IC)

• Power, RF, & Peripheral ICs:

• MT6186MV | MT6366MW | MT6631N

• SDR735 | OM8816-51 | 2336-62 | QPM5577

• S2MF301A | SM5461 | SMA1305 | SM3010B

• 2336-62 | QPM5577 |

• Additional universal small chip/component pads at the bottom.

Key Features:

• Superhard Series Construction: Resists thermal deformation and flexing during heavy hot-air station usage.

• Precision Laser Etching: Square and round aperture designs ensure smooth demolding without dragging solder paste.

• Optimal 0.12mm Thickness: Ideal balance for CPU and sub-IC tin planting, delivering consistent ball height.

• Multi-Chip Convenience: Combines CPU, NAND/UFS, PMIC, and RF stencils for the Samsung A17 series and other MTK/Qualcomm platforms into a single plate.

Technical Specifications

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