AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series
AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series

AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series

Attribute

Details

Brand

AMAOE (阿毛易修)

Model

SAM:22

Series

Superhard (超硬系列)

Thickness

0.12mm

Primary Compatibility

Samsung Galaxy A17 & other MT6789V / SM6475 / MT6769V models

Barcode / Part No.

41012779

Patent Number

ZL2016213989365

₹300.00

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AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series
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AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series

 

AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series

 

 

 

Product Title AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series

Short Description (For WooCommerce Product Summary) Original AMAOE SAM:22 Superhard 0.12mm BGA Reballing Stencil. Specifically engineered for Samsung A17 and compatible smartphones featuring MediaTek MT6789V, MT6769V, and Qualcomm SM6475 CPUs, along with BGA254 memory, RF transceivers, and power management ICs.

Full Product Description

Upgrade your micro-soldering precision with the AMAOE SAM:22 Superhard Series BGA Reballing Stencil. Crafted from high-grade 0.12mm imported Japanese stainless steel, this stencil is designed with anti-drum (anti-bulging) reinforcement holes around the primary CPU cutouts to prevent warping under high hot-air rework temperatures. It provides accurate hole alignment for seamless solder paste application and uniform solder ball formation.

Supported ICs & Cutouts on Stencil:

  • Main CPUs (Processors):

  • MT6789V (MediaTek Helio G99)

  • SM6475 (Qualcomm Snapdragon 6 Gen 3)

  • MT6769V (MediaTek Helio G85 / G80)

  • Memory / Storage:

  • BGA254 (UFS / eMCP Memory IC)

  • Power, RF, & Peripheral ICs:

  • MT6186MV | MT6366MW | MT6631N

  • SDR735 | OM8816-51 | 2336-62 | QPM5577

  • S2MF301A | SM5461 | SMA1305 | SM3010B

  • 2336-62 | QPM5577 |

  • Additional universal small chip/component pads at the bottom.

Key Features:

  • Superhard Series Construction: Resists thermal deformation and flexing during heavy hot-air station usage.

  • Precision Laser Etching: Square and round aperture designs ensure smooth demolding without dragging solder paste.

  • Optimal 0.12mm Thickness: Ideal balance for CPU and sub-IC tin planting, delivering consistent ball height.

  • Multi-Chip Convenience: Combines CPU, NAND/UFS, PMIC, and RF stencils for the Samsung A17 series and other MTK/Qualcomm platforms into a single plate.

Technical Specifications

Attribute

Details

Brand

AMAOE (阿毛易修)

Model

SAM:22

Series

Superhard (超硬系列)

Thickness

0.12mm

Primary Compatibility

Samsung Galaxy A17 & other MT6789V / SM6475 / MT6769V models

Barcode / Part No.

41012779

Patent Number

ZL2016213989365

SEO Tags / Keywords (Copy-Paste to WooCommerce Tags) AMAOE SAM 22, SAM22 Stencil, MT6789V Stencil, SM6475 Stencil, MT6769V Stencil, BGA254 Stencil, Samsung A17 CPU Stencil, MT6366MW Stencil, SDR735 Stencil, S2MF301A Stencil, QPM5577 Stencil, AMAOE 0.12mm Stencil, 41012779


shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of  RS 80  will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

Shipping Partner Dtdc Courier

Tracking Link

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We Currently Ship Products Only Within India. You Can Place Orders From Across The World But Delivery Addresses Are Restricted To India.

We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com    Or     Call 9895333473

Cash On Delivery (Cod) Available

 

Advance Payment Rs 100

COD SHIPPING CHARGE RS150/- ALL INDIA

Thousand Rupees Above Order Full Amount Cod Available

Cash On Delivery Availability, Check Your City PinCod  

LINK

Location Finder

RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME

Tracking Link

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AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series
AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series

₹300.00

Add to cart

Need help? Call our award-winning support team 24/7 at +919895333473

Adress

  • Binu Mobiles 
  • No. 6/429-c (12)
     Land Ship Mall,
     Mavoor Road Junction,
     Kozhikode, Pin - 673001 
  • (+91) 9895333473
Mobileicbinu@gmail.com

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Product Subtotal
Exynos stencil samsung CPU 2 QS23  × 1 ₹350.00
Samsung 3 stencil QiANLi QS42 J1-2-3-4 series J100H/J2/J320F/G570M Exynos7570/3475, SC9830A/7730S CPU  × 1 ₹350.00
Subtotal ₹700.00
Shipping
Total ₹780.00

  • it uses upi apps like bhim, paytm, google pay, phonepe or any banking upi app to make payment.
    if you need any help whatsapp 9895333473
    product delivery all india 3 to 7 days delivery time dtdc courier

Subtotal:
₹700.00
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AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series
AMAOE SAM:22 BGA Reballing Stencil (0.12mm) for Samsung A17 – MT6789V / SM6475 / MT6769V CPU & Power IC Series
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₹300.00
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