AMAOE S23FE MIDDLE LAYER BGA REBALLING STENCIL FOR SAMSUNG S23 FE SM-S711B
AMAOE S23FE MIDDLE LAYER BGA REBALLING STENCIL FOR SAMSUNG S23 FE SM-S711B
Original price was: ₹350.00.₹349.00Current price is: ₹349.00.
AMAOE S23FE MIDDLE LAYER BGA REBALLING STENCIL FOR SAMSUNG S23 FE SM-S711B

AMAOE S23FE MIDDLE LAYER BGA REBALLING STENCIL FOR SAMSUNG S23 FE SM-S711B
AMAOE S23FE MIDDLE LAYER BGA REBALLING STENCIL FOR SAMSUNG S23 FE SM-S711B
AMAOE S23FE MIDDLE LAYER BGA REBALLING STENCIL
Highlights
For AMAOE S23FE SM S711B S711BE MIDDLE LAYER BGA REBALLING STENCIL
Brand AMAOE
Model
S23FE SM S711B MIDDLE LAYER BGA REBALLING STENCIL
AMAOE S24 FE SM-S711 MIDDLE LAYER BGA REBALLING STENCIL FOR SAMSUNG S24FE SM-S711BE / W / 0 / D
item model supporting ic cpu ram pa number
S23FE SM S711B MIDDLE LAYER STENCIL
Square Pattern
stainless steel Material
SIZE:70*7OMM T:0. 12MM
Color: silver
Specifications
In The Box
Number of Contents in Sales Package
Pack of 1
Country of Origin China
General
Pattern Square
Material stainless steel
Suitable For Possible Value
Re-usable Yes
Net Quantity 1
Dimensions
Item Weight 50 g
shipping & delivery
LINK
Location Finder
RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME
Tracking Link
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AMAOE S23FE MIDDLE LAYER BGA REBALLING STENCIL FOR SAMSUNG S23 FE SM-S711B
Original price was: ₹350.00.₹349.00Current price is: ₹349.00.
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