AMAOE RX5-012 Reballing Stencil for Realme X50 Pro

This is a professional-grade reballing stencil from AMAOE, designed for an advanced and highly specific repair: the middle layer of the Realme X50 Pro motherboard. Crafted with the experience of repair professionals in mind, this tool offers a precise and reliable solution for complex, multi-layer board repairs.

Key Features & Benefits

Dedicated to Realme X50 Pro (中层网): This stencil is a precision tool specifically for the middle layer of the Realme X50 Pro’s motherboard. This layer contains critical ICs that are “sandwiched” between the upper and lower boards, and a dedicated stencil is required for a successful repair.
Strong Magnetic Properties (强磁性): A key innovation, the strong magnetic property allows the stencil to securely and quickly align with a magnetic reballing jig. This prevents any shifting or movement during the application of solder paste, a crucial benefit for the precision required in a middle-layer reballing job.
Ultra-Precision 0.12mm Thickness: With an optimal thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to the chip’s microscopic pads. This precision is essential for preventing shorts and creating a robust, reliable connection.
Perfect Dimensions: The stencil’s size is 70x70mm, ensuring it perfectly fits a standard reballing jig while providing ample space for the middle layer’s components.
Made for Professionals: The “AMAOE Easy Repair” brand promise, “Tools made with the repairman’s experience in mind,” guarantees a user-friendly and effective product that solves real-world repair challenges.

Technical Breakdown

Model: RX5-012
Brand: AMAOE (阿毛易修)
Material: Stainless Steel
Pattern: Square
Thickness: 0.12mm
Color: Silver
Item Weight: 30 g
Country of Origin: China
Net Quantity: 1
Reusable: Yes
Compatible Device: Realme X50 Pro Motherboard (middle layer)
Dimensions: 70 x 70 mm
Thickness: 0.12mm
Special Features: Strong Magnetic Alignment
Repair Scenario: This stencil is used to reball the BGA-packaged chips that connect the upper and lower halves of the Realme X50 Pro’s motherboard. This is a common repair for issues like a phone that won’t turn on, gets stuck in a boot loop, or experiences a complete lack of power.