This is a professional-grade reballing stencil from AMAOE, designed for a highly specific and advanced repair. The K3P-012 model is engineered to work with the Redmi K30 Pro’s PCB (Printed Circuit Board) and is part of a “PCB suit,” which indicates it is designed for a complex motherboard repair. This tool is essential for technicians who perform component-level repairs on this device.
Dedicated to Redmi K30 Pro: This stencil is a precision tool specifically designed for the motherboard of the Redmi K30 Pro. This phone uses the Qualcomm Snapdragon 865 chipset, and a dedicated stencil is crucial for a successful repair on its fine-pitch BGA components.
“PCB Suit” Compatibility: The stencil is part of a set of tools intended for full board-level repair. This means it may include patterns for the main CPU, power management ICs, and other critical chips on the motherboard.
Made with Professional Experience: The “AMAOE Easy Repair” brand promise, “Tools made with the repairman’s experience in mind,” guarantees a reliable and effective product that solves real-world repair challenges.
Patented Design: The product is noted as a patented design, which reinforces its status as a unique and professionally-developed tool.
Material: Stainless Steel
Pattern: Square
Dimensions (W x H): 10 x 8 cm
Thickness: 0.12mm
Color: Silver
Item Weight: 50 g
Country of Origin: China
Net Quantity: 1
Reusable: Yes
shipping & delivery
Shipping & Delivery information :
Shipping Charges: A shipping fee of  RS 80  will be applied to orders
Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.
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